According to one embodiment, a template includes a base body, and a first film. The base body has a first surface and a second surface. The first surface includes silicon oxide and spreads along a first plane. The second surface crosses the first plane. The first film includes aluminum oxide. A direction from the second surface toward the first film is aligned with a direction perpendicular to the second surface. A thickness of the first film along the direction perpendicular to the second surface is not less than 0.3 nm and not more than 10 μm. The first surface includes an unevenness.

A method of manufacturing a polymer composite having an embedded functionality includes the following steps: providing a dry non-conductive fiber fabric having a nominal weight from 25-600 g/m.sup.2; selecting a paste having viscosity below 600 Pa-s, the paste being a conductive paste, dielectric paste and/or a sensing paste; and applying the selected paste on the dry non-conductive fiber woven fabric by either screen-printing or micro-dispensing, thus making a printed functionality. The method further includes the step of forming a laminate having the dry non-conductive fiber woven fabric having the printed functionality and at least one additional fabric or core; and obtaining a polymer composite from the laminate.

Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.

Provided is a processing method for an object, including the steps of: arranging an object in a first portion that is a portion having a space and configured to process the object; and decomposing an organic substance in the object by covering the object with catalysts formed of granules made of a metal oxide containing titanium and bringing the catalysts into contact with the organic substance, and simultaneously maintaining the catalysts in the first portion at a temperature of 480° C. or more and 550° C. or less. The step of decomposing the organic substance in the object includes causing gas containing oxygen to flow into the first portion so that a decomposition reaction of the organic substance occurs, and the catalysts are slightly moved in at least a part of a surface of the object.

A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

A functional vehicle component and related methods include a transmitter coil and a molded part. The molded part includes a first thermoformed film, a molded polymeric structural layer arranged under the film, a printed electronic circuit arranged under the film and adjacent the structural layer, an optional second thermoformed film, and graphics on the first film. The electronic circuit includes a receiver coil, conductive traces, and electronic elements. The first film is arranged to cover the polymeric structural layer and the electronic circuit to thereby define an exposed surface of the molded part. The first film and/or the graphics camouflages the circuit. The transmitter coil is connected to an external power source, and is arranged on the molded part such that the receiver coil is inductively coupled to the transmitter coil so as to wirelessly power the electronic elements of the circuit.

Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.

Here are described composite panels comprising at least one integrated or embedded electrical circuit, their methods of manufacturing and their use in the aeronautic and aircraft industries. Also described are aircraft components including the composite panel as defined herein.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.