An over-molded thin film antenna device is provided that can include a core mandrel having a body and a lip, a thin film radio frequency (RF) element wrapped around and supported by the body, an RF connector electrically coupled to the thin film RF element, and an outer layer molded between shutoff surfaces of the core mandrel and over the thin film RF element. The lip can extend over a top of a portion of the thin film RF element to secure the portion of the thin film radio frequency element between the body and the lip.

A method of forming a feed cone for a microwave antenna includes the steps of: providing a digitized design for a feed cone, the feed cone comprising a plurality of geometric features that vary in area along an axial dimension of the feed cone; subdividing the digitized design into a plurality of thin strata stacked in the thickness dimension; forming a thin layer of material corresponding to one of the thin strata; fixing the thin layer of material; and repeating steps (c) and (d) to form a feed cone.

A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.

The device intended to be thermoformed comprises a substrate capable of being thermoformed and an electrically conductive member integral with the said substrate. The electrically conductive member comprises: electrically conductive particles, an electrically conductive material, electrically conductive elements of elongated shape. The electrically conductive material has a melting point which is strictly less than the melting point of the electrically conductive particles and than the melting point of the elements of elongated shape.

Exemplary embodiments are described herein for compactable antennas and methods of making such an antenna. Exemplary compactable antennas include a support structure and a reflector surface. The support structure may directly or indirectly define the reflector shape. Exemplary embodiments comprise deployable support structures to permit the compactable antenna to have a smaller volume stowed configuration and a larger volume deployed configuration.

An over-molded thin film antenna device is provided that can include a core mandrel having a body and a lip, a thin film radio frequency (RF) element wrapped around and supported by the body, an RF connector electrically coupled to the thin film RF element, and an outer layer molded between shutoff surfaces of the core mandrel and over the thin film RF element. The lip can extend over a top of a portion of the thin film RF element to secure the portion of the thin film radio frequency element between the body and the lip.

Various components, such as radio frequency (RF) or thermal reflectors, may be constructed from joining of pre-formed tape. For reflectors, this process may reduce the number of ribs, only require partial ribs, or eliminate the use of ribs altogether. To build such a reflector, a spool of tape, a joining tractor, and a foundation ring may be employed.

The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.

A method of manufacturing a radar transparent cover may include steps of: injection molding a first transparent cover; inserting into a mold the first transparent cover made by the step of injection molding the first transparent cover and then, double injection molding a color resin on a back surface of the first transparent cover; and inserting into a mold the injection molded article made by the step of double injection molding the color resin and then, double injection molding a second transparent cover on a front surface of the first transparent cover.

A low profile phased array antenna that is configured to be manufactured using additive manufacturing techniques is provided. In one or more embodiments, the phased array can include a plurality of signal ears, ground ears, and clustered pillars that can be arranged in relation to a base plate such that each component of the antenna can be manufactured from a single piece of material, thereby allowing for the use of additive manufacturing techniques which can substantially reduce the cost and time of the manufacturing process. The phased array can include a signal ear that include one or more posts that interface with an airgap located within a base plate of the array, wherein the size of the airgap in relation to the size of the post is configured to achieve an optimal level of impedance matching.