B29L2031/3475

Display module and method for molding display module
11527687 · 2022-12-13 · ·

A method for molding a display module includes forming a cavity using a die plate of a first die and a plurality of side surface dies; filling the cavity with a coating material; fixing the display module to a second die using a coupling body disposed on a second surface of the display module, opposite of a first surface of the display module disposed with a plurality of LEDs; soaking the display module in the coating material filled in the cavity; curing the coating material; and separating the cured coating material of the display module from the die plate.

Facial interfaces for head-mounted displays and related systems and methods

A head-mounted display may include a frame for supporting an electronic display for viewing by an intended user donning the head-mounted display. The frame may include a flange disposed on a perimeter area of the frame and a facial interface configured to abut against an intended user's face wherein the facial interface comprises a foam body and an undercut region in the foam body that is sized and shaped for detachably engaging with the flange of the frame. Various other apparatuses, systems, and methods are also disclosed.

OVERLAY APPLICATOR TRAY AND METHOD OF USING THE SAME

An overlay applicator tray including a cradle including a device slot. The device slot is configured to securely hold an electronic device in the cradle. The overlay applicator tray also can include an overlay applicator. The overlay applicator can include an overlay layer and an adhesive release liner. The overlay layer can include a top side and a bottom side. The bottom side is configured to be adhered to a screen of the electronic device. The adhesive release liner is removably attached to the bottom side of the overlay layer. The overlay applicator tray additionally can include an alignment piece coupling the cradle to the overlay applicator. The alignment piece aligns the overlay layer of the overlay applicator with the screen as the overlay layer is applied to the screen when the electronic device is securely held in the device slot. The overlay applicator tray further can include a first pull tab on the adhesive release liner. The first pull tab is configured to be pulled to remove the adhesive release liner from the bottom side of the overlay layer and expose an adhesive of the overlay layer. Other embodiments are described.

Adhesive application apparatus

There is provided an adhesive application apparatus capable of efficiently applying an adhesive without inhibiting curing of the adhesive. An adhesive application apparatus of the present invention includes a mounting table 10, an adhesive dosing unit 20, and an ultraviolet irradiation unit 30, and it applies a delayed-ultraviolet-curable adhesive 200 to a surface of a panel 100. The panel 100 is mounted on a mounting surface S10 of the mounting table 10. The adhesive dosing unit 20 applies the adhesive 200 to the surface of the panel 100 mounted on the mounting table 10 by discharging the adhesive 200 from an adhesive dosing port H20. The ultraviolet irradiation unit 30 irradiates the adhesive 200 dosed from the adhesive dosing port H20 with ultraviolet light L. Here, the ultraviolet irradiation unit 30 irradiates the adhesive 200 with the ultraviolet light L along the mounting surface S10 before the adhesive 200 dosed from the adhesive dosing port H20 is applied to the surface of the panel 100.

Molded body for electronic function, method for manufacturing the same, and operation device using molded body for electronic function

A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.

DISPLAY MODULE AND METHOD FOR MOLDING DISPLAY MODULE
20230054995 · 2023-02-23 · ·

A display module is provided that includes a substrate and a molding part. The substrate includes a first surface disposed with a plurality of LEDs, and a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body. The molding part covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.

Two-color molding die, manufacturing method of two-color molded article, and imaging device including optical functional components
11584055 · 2023-02-21 · ·

A two-color molding die includes: a fixed primary die; a fixed secondary die; and a movable die. The fixed primary die includes a first concave portion. The movable die includes a second concave portion facing the first concave portion, and a core pin that protrudes from a base end surface of the second concave portion toward a base end surface of the first concave portion to form a tubular primary molding cavity between the core pin and the first concave portion and the second concave portion. The fixed secondary die includes a third concave portion configured to form a concave secondary molding cavity.

Apparatus for manufacturing display device and method of manufacturing display device
11584090 · 2023-02-21 · ·

There is provided a an apparatus for manufacturing a display device. An apparatus for manufacturing a display device comprises a body generating ultrasonic vibration; and a horn including a horn body portion connected to the body and amplifying the ultrasonic vibration and a horn tip portion connected to the horn body portion and applying the ultrasonic vibration onto a bonding object, wherein the horn body portion includes at least one body groove surrounded by the horn body portion and completely penetrating the horn body portion in a thickness direction from the surface of the horn body portion.

DRY APPLY PROTECTIVE METHODS

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

FORMING COMPLEX GEOMETRIES USING INSERT MOLDING

Examples are disclosed herein that relate to creating undercuts and other complex geometries in an injection molded article. One example provides a method of forming an injection molded article comprising an undercut structure, the method comprising inserting an insert piece into a mold for forming the molded article, the insert piece comprising sacrificial material, injection-molding the molded article, thereby incorporating the insert piece into the injection molded article, and machining the insert piece to form the undercut structure from the sacrificial material.