The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.

An enclosure part for an information handling system is disclosed that may include materials formed together into a rectangular shape. The enclosure part may have a void on a core side and a flatness equal to or less than 0.5 mm. The materials may include a sheet of carbon fiber, a piece of non-woven carbon fiber, and a non-woven glass fiber. A method for manufacturing an enclosure part using through-plane temperature control may include inserting into a mold a sheet of carbon fiber and a piece of non-woven carbon fiber, heat pressing the sheet of carbon fiber with the piece of non-woven carbon fiber, and cooling a first portion of the mold including the sheet of carbon fiber and the piece of non-woven carbon fiber more quickly than a second portion of the mold including the sheet of carbon fiber, and removing the enclosure part from the mold.

An electronically commutated direct current motor with a housing, a housing cover, a bearing shield, a rotor and a stator, wherein the rotor includes a shaft and a permanent magnet and the stator consists of single terminals, which are provided with terminal insulation. The direct current motor ensures a space-saving construction connection of motor components or components with the housing of the electronic commutated direct current motor, conforming to its class, wherein additional connections or sealing elements are not required, wherein a firm and sealed connection can be manufactured upon demand and an easy integration of other functions and interfaces is possible.

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

A polar functional group is added onto a surface of a metallic member. A resin member contains an adhesive functional group. The adhesive functional group and the polar functional group attract each other. A method for joining the metallic member and the resin member to each other includes: heating a junction between the metallic member and the resin member while pressing the metallic member and the resin member against each other with a first load; maintaining temperature of the junction higher than melting temperature of a resin that structures the resin member while pressing the metallic member and the resin member with each other with a second load smaller than the first load; and cooling the junction to temperature lower than the melting temperature while pressing the metallic member and the resin member against each other with a third load larger than the second load.

A method of covering a device includes splitting a sheet of non-woven material between a cosmetic surface of the non-woven material and a non-cosmetic surface of the non-woven material. This produces two sheets—a cosmetic sheet of the non-woven material including the cosmetic surface and a first split surface opposite the cosmetic surface, and a non-cosmetic sheet of the non-woven material including the non-cosmetic surface and a second split surface opposite the non-cosmetic surface. The method further includes applying an at least partially transparent coating to the non-cosmetic surface of the non-cosmetic sheet. The first split surface of the cosmetic sheet is affixed to a first portion of the device, and the second split surface of the non-cosmetic sheet is affixed to a second portion of the device.

A vehicular camera module includes a circuit element and a lens mounting element disposed at the circuit element and optically aligned with an imager of the circuit element. An inner lower pressure polymer molding is formed at least partially over and around the circuit element and the lens mounting element so that the inner molding and the lens mounting element substantially encase the circuit element. A connector element is disposed at an aperture of the inner molding so as to be in electrical contact with the electrical connecting elements of the circuit element. An outer higher pressure injection molded shell is molded over and around the inner molding and part of the lens mounting element so as to encase the inner molding. The outer shell includes a connector portion that generally surrounds the connector element, with the connector element being accessible at the connector portion of the outer shell.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

A housing includes a metal substrate, an adhesive layer formed on the metal substrate, and a resin film formed on the adhesive layer, the metal substrate, the adhesive layer and the resin film cooperatively form a cavity through a stamping process, an internal structure needed by the housing is formed in the cavity through an injection process, and the internal structure is formed on the resin film.

An apparatus for molding a physical body comprising at least two mold materials, wherein the apparatus comprises a first mold tool and a second mold tool configured for defining a mold volume in between in which the physical body is moldable by supplying the at least two mold materials, and a supply unit configured for separately supplying the at least two mold materials to the mold volume, wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume after having supplied the first mold material to the mold volume and before and/or during supplying the second mold material to the mold volume.