Patent classifications
B29L2031/3481
COVERS FOR ELECTRONIC DEVICES
The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.
MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.
METHOD FOR MANUFACTURING A SWITCHING APPARATUS FOR ELECTRIC SYSTEMS
The present disclosure is directed to a for manufacturing a switching apparatus for electric systems. The method includes (i) providing a first housing shell of the switching apparatus; (ii) providing a second housing shell of the switching apparatus; (iii) assembling the first and second housing shells and a number of operating components of the switching apparatus, thereby obtaining a preliminary assembly of the switching apparatus; and (iv) joining first and second coupling edges of the first and second housing shells through a vibration welding process, thereby forming a junction between the first and second housing shells and obtaining a sealed outer casing for the switching apparatus.
METAL-PLASTIC COMPOSITE PART AND METHOD OF MAKING SAME, AND ELECTRONIC DEVICE HOUSING HAVING SAME
A method for making a composite piece comprised of a metal part and a glass-fiber-reinforced plastic part, comprising: providing a metal part with a receiving cavity and a flow guiding channel, the flow guiding channel having an inlet communicating with the receiving cavity and an outlet; introducing molten plastic reinforced with glass fibers into the receiving cavity to fill the receiving cavity and the flow guiding channel and overflows from the outlet to form a flash section; curing the molten plastic to obtain a plastic part; removing unwanted portion of the metal part together with a portion of the plastic part to obtain the composite piece, wherein the glass-fiber-reinforced plastic part includes an exposed surface and glass fibers exposed at the exposed surface are substantially parallel to each other. A metal-plastic composite part prepared by the method and an electronic device housing are also disclosed.
Joining material for laser welding and laser welding method using the same
A joining material for laser welding, a laser welding method using the same, and a laser joined body using the laser welding method. The joining material includes a polymer matrix and a needle-shaped inorganic filler. The polymer matrix includes a polypropylene resin having a melt index of 80 g/10 min or more to 95 g/10 min or less as measured at a temperature of 230° C. and a load of 2.16 kg, and the needle-shaped inorganic filler has an aspect ratio of 10:1 to 20:1.
HOUSING OF AN ELECTRONIC MODULE AND PRODUCTION THEREOF
In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.
HEATABLE PLASTICS COMPONENT AND METHOD FOR PRODUCING
A method for manufacturing a heatable plastic component for a motor vehicle, which includes: providing a planar heating film, which has a first surface and a second surface that faces away from and is opposite the first surface, including at least one heating wire and connecting elements; introducing the planar heating film into an injection mold; mounting a connector housing onto the connecting elements; and back-molding the first surface with a plastic for manufacturing a first partial element of the heatable plastic component in the injection mold. In order to provide an improved method for manufacturing a heatable plastic component, it is proposed that a back-molding of the second surface with a plastic for manufacturing a second partial element of the heatable plastic component in the injection mold takes place such that a composite is formed from the first partial element, the planar heating film and the second partial element.
ELECTRONIC DEVICE HOUSING, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Provided are an electronic device housing and a manufacturing method therefor, and an electronic device. The electronic device housing comprises: a housing body, wherein the housing body comprises a bottom wall and at least one side wall connected to the bottom wall, an outer surface of the bottom wall is a flat surface or a curved surface, an outer surface of the side wall is a curved surface, and at least a part of the surface of at least one of the bottom wall and the side wall is provided with a millimeter-scale three-dimensional texture.
INJECTION MOULDING PROCESS APPLIED TO METAL SHELL, THE METAL SHELL, AND MANUFACTURING PROCESS METHOD OF THE METAL SHELL
An injection molding process method of a plastic part on a metal shell to form a high-strength combination comprises: forming a molding cavity which is inwardly concave from the outer surface and extending through flanges at periphery of the metal shell to area beneath bridges protruding from flanges, the bridges being removed after the injection molding. A plastic part with slight deformation is in the molding cavity and is tightly combined with the metal shell due to the bridges. The protruding bridges can be removed from the flanges by milling or cutting without damaging the plastic part, thus the plastic part does not require to be remachined, and the appearance of the metal shell is not affected.
MONOLITHIC REMOTE CONTROL
A plastic housing for remote controls, the housing comprising a first housing part and a second housing part, wherein the first housing part has a joining surface facing the second housing part, and the second housing part has a joining surface facing the first housing part, wherein the two housing parts are assembled such that the joining surfaces rest against each other, and wherein the joining surfaces are in the form of mitred surfaces.