Patent classifications
B29L2031/3481
BUTTON ASSEMBLY AND METHOD OF MANUFACTURING THEREOF
A method of manufacturing a button-enabled housing assembly includes preforming a composite button component or insert having an elastically flexible button membrane that is mounted on a rigid frame, and thereafter molding a housing over the button insert. The composite button insert is formed in a co-molding operation and can include a rigid island in the flexible button membrane for supporting a cosmetic keycap.
Watertight welding methods and components
A method for watertight welding, and components formed using that welding method, wherein the welding method includes providing a first component half with a groove and a protruding ridge located therein, providing a second component half with a tenon shaped to match the profile of the groove, disposing the tenon inside the groove such that the tenon contacts the protruding ridge, applying an ultrasonic power source near the groove to melt the protruding ridge, and applying opposing vertical force to the first component half relative to the second component half, such that the protruding ridge wedges in a bonding seam between an outside surface of the tenon and an inside surface of the groove.
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
Device for manufacturing rotor core and method for manufacturing rotor core
Provided is a manufacturing device and a manufacturing method for a rotor core that can prevent damage from being caused to an end of a magnet due to movement of the magnet when injecting a resin material. Included are a first mold including a fitting recess that fits and holds a laminated iron core in which a magnet is inserted into a magnet insertion hole, a second mold that is engaged with the first mold and clamps and seals the laminated iron core together with the first mold, a resin injection unit that is provided to the second mold, and injects a resin material into the magnet insertion hole, and a magnet positioning and holding mechanism that positions and holds the magnet in a state of being fit into the fitting recess of the first mold.
Wireless charging mouse
A wireless charging mouse includes an upper housing, a lower housing, and a coil board. The lower housing is fixed to the upper housing and has an aperture for exposing a displacement sensing module. The coil board is integrally embedded in the lower housing by means of injection molding such that the coil board and the lower housing are formed as a one-piece structure.
Structural fiber component for injection molding in head mounted displays
A set of augmented reality (AR) or virtual reality (VR) glasses are disclosed. The glasses comprise a fiber reinforced structure. The fiber reinforced structure includes a continuous fiber component. The fiber reinforced structure also includes a thermoplastic material injection molded over the continuous fiber component, wherein the thermoplastic material surrounds the continuous fiber component. The glasses also comprise electronics that are coupled to the fiber reinforced structure, wherein the electronics are configured to facilitate presentment of imagery onto a lens of the glasses.
Polyamide molding material, the use thereof, and molded parts produced therefrom
A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.
Manufacturing method of housing and electronic device
The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing. The housing made of the first material exhibits a second material effect in visual and/or tactile senses.
PROBE
A probe assembly and a method of manufacturing a probe assembly. In one aspect there is a method of manufacturing a probe assembly comprising providing an electrode carrier carrying a plurality of electrodes, the electrode carrier comprising a top wherein the plurality of electrodes are exposed relative to the top and a bottom having a plurality of electrical contacts in electrical communication with the plurality of electrodes respectively; moulding a body around the electrode carrier to retain the electrode carrier whilst leaving the plurality of electrodes exposed. The invention also extends to a biomass monitoring system comprising a flexible enclosure including a probe assembly and support arrangement for receipt of the probe assembly in an engaged configuration.
Retention features of a portable computer
A portable computing device is disclosed. The portable computing device includes a retention member that provides a force to a flexible circuit disposed in a top portion and a bottom portion of the portable computing device. The retention member limits movement of the flexible circuit when, for example, the flexible circuit receives a force in response to the top portion pivoting with respect to the bottom portion. The bottom portion of the portable computing devices includes a bottom case having multiple terraced regions. The terraced regions allow the bottom portion to receive additional internal components, such as one or more battery packs, a main logic board, and/or one or more speaker modules. The battery packs are secured to the terraced region via adhesive rings. Although the terraced regions require additional material removed from the bottom case, the internal components secured to the bottom case provide structural support.