A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.

The invention relates to a process for manufacturing a plastic-metal hybrid part by plastic overmolding on a metal surface via nano-molding technology (NMT), wherein the moldable plastic material is a polymer composition comprising thermoplastic polyamide, or a thermoplastic polyester, or a blend thereof, and boron silicon glass fibers. The invention also relates to a plastic-metal hybrid part, obtainable by said process, wherein a metal part is overmolded by a polymer composition comprising thermoplastic polyamide, or a thermoplastic polyester, or a blend thereof, and boron silicon glass fibers.

A molding method includes: setting a bus bar at a first mold main body portion of a fixed mold by supporting a terminal base of a tuning-fork terminal with a terminal base receiving portion of the fixed mold in a state where the tuning-fork terminal is protruded outside a cavity formed by the first mold main body portion of the fixed mold and a second mold main body portion of a movable mold being joined together; joining the movable mold together with the fixed mold by abutting an abut step portion of the movable mold to a receiving abut step portion of the fixed mold and nipping the terminal base of the tuning-fork terminal with the terminal base receiving portion and a terminal base abut portion of the movable mold; and injecting resin into the cavity in the nipped state.

Systems and methods for lighting system lens heating are described. The systems and methods include a substantially clear thermoplastic substrate; and a conductive ink or film circuit on the thermoplastic substrate.

Method for manufacturing a mechatronic system comprising: a step of manufacturing a mechanical structure (SM) by three-dimensional printing by fused filament deposition of at least one first electrically insulating material (M1), and a step of manufacturing at least one electrical component (CE) in contact with at least one element of said mechanical structure and secured therewith; characterized in that said step of manufacturing at least one electrical component is implemented by three-dimensional printing by fused filament deposition of at least one second material (M2), conductive or resistive, directly in contact with said element of the mechanical structure. Apparatus for implementing such a method. Mechatronic system that can be manufactured by such a method.

The invention relates to a method for producing a multilayer body, with the steps: a) Providing a carrier ply, on which at least one illuminant, in particular an LED, is arranged; b) Providing a decorative ply; c) Injection-molding a plastic ply onto the carrier ply and/or the decorative ply in an injection-molding tool. The invention further relates to a multilayer body produced by means of such a method.

A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.

A method of manufacturing a composite material including at least one ply integrating at least one electronic element situated at the surface of the ply. Also, materials obtained thereof and devices including such materials. The method includes: a) preparing or providing a first substrate having at least one layer; b) applying at least one electronic element onto a face of the first substrate; c) at least partially impregnating the so-obtained product within an impregnation material to form a matrix incorporating the at least one electronic element and the first substrate; d) preparing or providing an impregnable second substrate, the second substrate being placed on top of the impregnated at least one electronic element so that the at least one electronic element is interposed between the first substrate and the second substrate; e) removing the first substrate from the impregnated product obtained; and f) recovering the composite material.

A resin-molding device capable of preventing a resin-molded product from being non-uniform in thickness. A resin-molding device includes: a first and second platen (outside-loaded platen) which are two plate-shaped members arranged parallel to each other to allow a molding die to be arranged in a die arrangement section which is a central region between the platens; a force applier (toggle link and tie bars) for applying a force to the platens from loading points located outside the die arrangement section; a heating mechanism (lower and upper heater plates) provided between the outside-loaded platen and the molding die; and a heat-insulating member (lower and upper heat-insulating members) formed by a plurality of elastic pillar members arranged between the outside-loaded platen and the heating mechanism, the pillar members configured so that the amount of deformation of each pillar member increases from the center of the die arrangement section toward the loading point.

An injection molding tool and method are used to create a connection between at least two metal parts. The metal parts are inserted into the injection molding tool. Using a clinching device of the injection molding tool, the metal parts are mechanically connected to one another by clinching and are encapsulated with a plastic material using an extruder connected to the injection molding tool so as to, at least partially, enclose the metal parts with overmolding or casting.