A connector and a method of retaining a contact in a housing. The method includes: inserting the contact into a contact receiving cavity of the housing; applying extruded material in layers into the contact receiving cavity with a precision controlled nozzle; filling voids in the contact receiving cavity layer by layer until the contact receiving cavity is filled; and cooling or curing the extruded material, allowing the extruded material to bond with a wall of the contact receiving cavity. The contact is securely maintained in the contact receiving cavity of the housing by the extruded material. The connector having a contact positioned in a contact receiving cavity of a housing. Extruded material is positioned in the contact receiving cavity. The extruded material is bond to walls of the contact receiving cavity, wherein the extruded material securely maintains the contact in the contact receiving cavity of the housing.

A vehicle may include a plurality of separate and distinct electrical busbars that are electrically isolated from each other. A device may include a polymer overmold material that mechanically couples the separate and distinct electrical busbars to each other in a single integrated multi-busbar unit, wherein the overmold material is provided to the busbars through an injection molding process. A device may include a flex printed circuit board having a plurality of sensors that is coupled to the single integrated multi-busbar unit, wherein the sensors are coupled to the distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit.

An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.

An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.

A connector assembly includes an outer contact and a cavity insert. The outer contact has a mating segment, a terminating segment, and a middle segment therebetween. The mating segment is configured to engage a mating outer contact of a mating connector assembly. The terminating segment is configured to be terminated to a cable. The cavity insert surrounds the middle segment of the outer contact. The cavity insert has an overmold body. An interior surface of the overmold body engages an exterior surface of the outer contact and follows contours of the exterior surface along the middle segment.

A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.

The invention relates to a method for producing a multilayer body, with the steps: a) Providing a carrier ply, on which at least one illuminant, in particular an LED, is arranged; b) Providing a decorative ply; c) Injection-molding a plastic ply onto the carrier ply and/or the decorative ply in an injection-molding tool.

The invention further relates to a multilayer body produced by means of such a method.

An electrical connector with thin interior walls is made by extruding a polymer or polymer composite into a sheet of approximately 0.25 mm to 0.5 mm thickness. The sheet is then calendered to a thickness of about 0.05 mm to 0.3 mm. The calendered sheet is cut into notched sections. The notched sections are assembled and placed into an injection molded housing of a connector. The sections are secured in place by using an adhesive, force fit, snap fit, or welding process to form the thin interior walls of the connector.

An electrical connector with thin interior walls is made by extruding a polymer or polymer composite into a sheet of approximately 0.25 mm to 0.5 mm thickness. The sheet is then calendered to a thickness of about 0.05 mm to 0.3 mm. The calendered sheet is cut into notched sections. The notched sections are assembled and placed into an injection molded housing of a connector. The sections are secured in place by using an adhesive, force fit, snap fit, or welding process to form the thin interior walls of the connector.

A method for preparing a micro-nano flexible conductive circuit based on ultrasonic driving of liquid metal comprises the following steps: preparing a mold with a channel pattern and a liquid metal chamber by 3D printing, and adding a well-mixed flexible substrate resin mixture into the mold; then, eliminating bubbles, curing, and stripping from the mold to obtain a bottom-uncovered flexible substrate; covering the bottom of the bottom-uncovered flexible substrate with a base plate to obtain a bottom-covered flexible substrate mold; fixing the bottom-covered flexible substrate mold on a metal fixture table, injecting liquid metal into the liquid metal chamber, allowing an ultrasonic welding machine to come in contact with the fixture table on one side, and applying ultrasound to fill the liquid metal in a channel; and removing the base plate to obtain a liquid metal flexible conductive circuit.