B29L2031/7562

Method of molding simple or complex micro and/or nanopatterned features on both planar or non-planar molded objects and surfaces and the molded objects produced using same

The present invention is a method that (i) allows for creating micro and/or nanostructures on either planar or non-planar three-dimensional surfaces in a single molding step, and (ii) allows for the molded production of complex high-aspect ratio micro and/or nanostructures including but not limited to cylinders, conical structures, low aspect-ratio channels, bumps, or posts. An example of such a complex structure are high aspect ratio pillars with enlarged mushroom-shaped or undercut tips which demonstrate enhanced, repeatable adhesion and shear strength on a variety of substrates when compared with other micro and/or nanostructures and unstructured materials. The mold of such a material requires an undercut feature that cannot be produced using typical micro/nano-molding processing techniques.

System and method for producing particles and patterned films

A system including a mold having a fluoropolymer wherein the mold defines a plurality of cavities having a predetermined shape and a cross-sectional dimension less than about 100 micrometers; a roller; a surface in cooperation with the roller to form a nip point configured to receive the mold, wherein the nip point is further configured to receive a substantially liquid composition and accelerate entry of the substantially liquid composition into the cavity. A method of forming particles including applying a substantially liquid composition to a mold, wherein the mold comprises a fluoropolymer and defines a plurality of cavities each having a broadest cross-sectional dimension of less than about 100 micrometers; nipping the mold between a roller and a surface such that the substantially liquid composition enters the cavities of the mold; and hardening the substantially liquid composition in the cavities of the mold to form a particle within each cavity, wherein the particle has a size and shape that substantially mimics the size and shape of the cavity of the mold.

METHOD FOR TRANSFERRING AN EMBOSSED STRUCTURE TO THE SURFACE OF A COATING AND COMPOUND STRUCTURE CONTAINING SAID COATING

The present disclosure relates to a method for transferring an embossed structure to at least a part of a surface of a coating (B2), using a composite (F1B1) composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), where the coating (B2) and the coating (B1) of the composite (F1B1) have embossed structures which are mirror images of one another. Also described herein is a composite (B2B1F1). Further described herein is a use of this composite for producing an at least partially embossed coating (B2) in the form of a free film or a composite (B2KF2) composed of a substrate (F2), at least one adhesive (K), and the coating (B2).

Method of thermoforming film with structured surface and articles

Presently described are methods of making an article comprising providing a structured film (1100) comprising a thermoformable planar base (212) layer and a structured surface (116, 216) layer disposed on a major surface (1200) of the planar base (212) layer wherein the structured surface (116, 216) layer comprises a different organic polymeric material than the thermoformable planar base (212) layer, and thermoforming the structured film (1100) into a thermoformed article (1000). Also described are thermoformed and thermoformable articles.