A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

A method of making an article includes mixing a filler material and a polymer matrix material to produce a composite material, introducing the composite material produced by the mixing into a mold of a desired shape, and removing an article having the desired shape from the mold. The resulting article has a water absorption of less than about one percent and the filler material comprises vitreous china.

A forming device has a machine frame and a forming apparatus disposed on the machine frame. At least one heating chamber is disposed on the machine frame. A heatable support is received in the at least one heating chamber in a position of use for preheating semi-finished products and can be moved in a movement direction out of the at least one heating chamber into a removal position for removal of preheated semi-finished products from the support. In the removal position, the support is at least partially located adjacent to the machine frame and enables access to preheated semi-finished products. At least one heating device is associated with the at least one heating chamber and has one or more convection heating devices that discharge at least one directable heating air flow.

A method of making a bathtub providing safe egress by reducing slide forces extended on a user's feet upon a slippery bathtub floor, wherein the formed bathtub has a limited rectangular footprint, and an optimized floor space is formed with a substantially planar base with a length and width that define the limited rectangular footprint and a front wall, a back wall, a first side wall and a second side wall integral with and extending substantially vertically upwards from the substantially planar base. Each of the front, back, first side wall and second side wall have minimal wall thicknesses to define the optimized floor space and the front wall has a substantially planar inwardly, cantilevered upper apron deck in a substantially parallel relation to the substantially planar base.

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.