B32B3/08

PLASTIC SUBSTRATE WITH IMPROVED HARDNESS AND DISPLAY DEVICE INCLUDING THE SAME
20180009200 · 2018-01-11 ·

A plastic substrate includes: a plastic support member having light transmittance; and a first organic-inorganic hybrid layer on the plastic support member. The first organic-inorganic hybrid layer includes: a first organic-inorganic hybrid matrix; and ions implanted into the first organic-inorganic hybrid matrix at a side opposite to a side adjacent the plastic support member. An amount of the ions per unit area is in a range from about 2×10.sup.13/cm.sup.2 to about 2×10.sup.14/cm.sup.2.

Reduced weight, multi-layer roofing shingles and methods for installing them
11708696 · 2023-07-25 · ·

One aspect of the disclosure is roofing shingle including a shim layer having a top surface, a first side edge, and a second side edge positioned opposite the first side edge. The roofing shingle also includes a top shingle layer at least partially laminated to the top surface of the shim layer, where the top shingle layer includes a first side edge offset a sidelap distance from the first side edge of the shim layer such that a side portion of the top surface of the shim layer is exposed, and a second side edge extending beyond the second side edge of the shim layer so as to overlap the second side edge of the shim layer by the sidelap distance.

Reduced weight, multi-layer roofing shingles and methods for installing them
11708696 · 2023-07-25 · ·

One aspect of the disclosure is roofing shingle including a shim layer having a top surface, a first side edge, and a second side edge positioned opposite the first side edge. The roofing shingle also includes a top shingle layer at least partially laminated to the top surface of the shim layer, where the top shingle layer includes a first side edge offset a sidelap distance from the first side edge of the shim layer such that a side portion of the top surface of the shim layer is exposed, and a second side edge extending beyond the second side edge of the shim layer so as to overlap the second side edge of the shim layer by the sidelap distance.

Thermal Vacuum Insulation Element
20230234324 · 2023-07-27 ·

A thermal vacuum insulation element (10) comprising a first planar limiting part (12) and a second planar limiting part (14). The limiting parts are spaced apart from each other and define an evacuated space (16) between them. The evacuated space (16) is sealed by means (26) for sealing. The vacuum insulation element includes first support elements (18) extending away from the first limiting part (12) into the evacuated space (16) and second support elements (20) extending away from the second limiting part (14) into the evacuated space (16), the limiting parts (12, 14) being arranged with the support elements (18, 20) such that the first support elements (18) and the second support elements (20) protrude beyond and are spaced from each other. The first support elements (18) are spaced from the second limiting part (14), and the second support elements (20) are spaced from the first limiting part (12). A fiber structure (22) interconnects the first support elements (18) and the second support elements (20). The fiber structure (22) has a low thermal conductivity and is configured to absorb at least the pressure caused by the vacuum on the first and second limiting parts (12, 14).

Thermal Vacuum Insulation Element
20230234324 · 2023-07-27 ·

A thermal vacuum insulation element (10) comprising a first planar limiting part (12) and a second planar limiting part (14). The limiting parts are spaced apart from each other and define an evacuated space (16) between them. The evacuated space (16) is sealed by means (26) for sealing. The vacuum insulation element includes first support elements (18) extending away from the first limiting part (12) into the evacuated space (16) and second support elements (20) extending away from the second limiting part (14) into the evacuated space (16), the limiting parts (12, 14) being arranged with the support elements (18, 20) such that the first support elements (18) and the second support elements (20) protrude beyond and are spaced from each other. The first support elements (18) are spaced from the second limiting part (14), and the second support elements (20) are spaced from the first limiting part (12). A fiber structure (22) interconnects the first support elements (18) and the second support elements (20). The fiber structure (22) has a low thermal conductivity and is configured to absorb at least the pressure caused by the vacuum on the first and second limiting parts (12, 14).

HEAT EQUALIZATION PLATE
20230240045 · 2023-07-27 ·

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

IC TAG AND MANUFACTURING METHOD

An IC tag according to the present invention includes: a base sheet having a first surface and a second surface; an IC chip arranged on the first surface of the base sheet; an antenna that is arranged on the first surface of the base sheet and is configured to electrically transmit and receive information stored in the IC chip; and a protective sheet that is fixed to the first surface of the base sheet via a bonding agent, so as to cover the IC chip and the antenna. The protection sheet has a protruding portion that protrudes along the IC chip.

METALIZED FILM AND FILM CAPACITOR INCLUDING METALIZED FILM
20230005665 · 2023-01-05 · ·

A metalized film includes a dielectric film having a first surface and a second surface opposite to the first surface. The dielectric film has a film thickness of 1 to 3 μm. The first surface has an arithmetic mean height. The second surface has an arithmetic mean height. The arithmetic mean heights are different. The first surface has a maximum height Sz1 satisfying the expression 100 nm<Sz1≤350 nm. The second surface has a maximum height Sz2 satisfying the expression 10 nm≤Sz2≤100 nm. The metalized film includes a metal film on the second surface.

INNER COVERING FOR CONTAINERS
20230002149 · 2023-01-05 ·

The invention relates to inner covering for containers, the objective of which is to reduce the impact of temperatures on the inside thereof and to protect against the moisture known as “container rain”. The covering is formed by a rectangular prismatic case (1) in the horizontal position, made from a laminated composite having several layers, with two smaller bases and a series of bars (4) arranged in fixing elements (3) corresponding to two or more edges of the smaller bases, characterized in that the bars (4) are formed by elements that can be inserted into one another.

Composite construction panels and applications thereof

In one aspect, composite construction materials are described herein. In some embodiments, a composite construction panel comprises a substrate layer, a cover layer separated from the substrate layer by one or more spacers, and at least one mat disposed between the substrate layer and the cover layer, wherein the mat comprises at least one phase change material disposed in at least one phase change region.