Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting the laminate structures to at least one thermal cycle comprising cooling the laminate structures to a first temperature near or below room temperature and heating the laminate structures to a second temperature near or below the lamination temperature. Also disclosed herein are laminate structures made according to such methods.

An assembling film, a method for assembling a display, and a display are provided. The assembling film has a photothermal deformation effect. The assembling film includes: an organic material layer, and an inorganic material layer stacked together with the organic material layer. A thermal expansion coefficient of the organic material layer is different from a thermal expansion coefficient of the inorganic material layer. The assembling film in the double-layered structure formed by the organic material layer and the inorganic material layer has a particular photothermal deformation effect, and is able to be bent and deformed when being heated, and thus can be used to assemble the display, so as to tackle the light leakage problem and realize the light shielding effect.

An assembling film, a method for assembling a display, and a display are provided. The assembling film has a photothermal deformation effect. The assembling film includes: an organic material layer, and an inorganic material layer stacked together with the organic material layer. A thermal expansion coefficient of the organic material layer is different from a thermal expansion coefficient of the inorganic material layer. The assembling film in the double-layered structure formed by the organic material layer and the inorganic material layer has a particular photothermal deformation effect, and is able to be bent and deformed when being heated, and thus can be used to assemble the display, so as to tackle the light leakage problem and realize the light shielding effect.

Uncured composite structures, cured composite structures, and methods of curing uncured composite structures are disclosed herein. The uncured composite structures include a structural layer that includes an uncured structural resin and a surface layer that includes an uncured surface resin. The cured composite structures include a cured structural layer that includes a cured structural resin, a cured surface layer that includes a cured surface resin, and an interface region between the cured surface layer and the cured structural layer. The methods include initially heating the uncured composite structure to an initial temperature to generate a partially cured composite structure. The initially heating is sufficient to gel the uncured surface resin but insufficient to gel the uncured structural resin. The methods also include subsequently heating the partially cured composite structure to a final cure temperature, which is greater than the initial temperature, to generate the cured composite structure.

A lead member for a secondary battery includes a conductor, and a covering material. The conductor has an upper surface and a lower surface that extend in a length direction and a width direction and are opposite to each other, and a first side surface and a second side surface that extend in the length direction and a thickness direction, connect the upper surface to the lower surface, and are opposite to each other. The covering material is formed by sticking a plurality of insulating films together to surround the upper surface, the first side surface, the lower surface, and the second side surface. Each of the plurality of insulating films includes an inner layer and an outer layer, in an order from a side closer to the conductor. The lead member includes a first insulator and a second insulator on the first side surface and the second side surface of the conductor respectively, in an area surrounded by the covering material of the conductor. The first insulator and the second insulator have a lower melting point than the inner layer. The first insulator and the second insulator are placed to be separated from each other.

According to one embodiment, a glass-ceramic composition may include from about 60 mol. % to about 75 mol. % SiO.sub.2; from about 5 mol. % to about 10 mol. % Al.sub.2O.sub.3; from about 2 mol. % to about 20 mol. % alkali oxide R.sub.2O, the alkali oxide R.sub.2O including Li.sub.2O and Na.sub.2O; and from 0 mol. % to about 5 mol. % alkaline earth oxide RO, the alkaline earth oxide RO including MgO. A ratio of Al.sub.2O.sub.3 (mol. %) to the sum of (R.sub.2O (mol. %)+RO (mol. %)) may be less than 1 in the glass-ceramic composition. A major crystalline phase of the glass-ceramic composition may be Li.sub.2Si.sub.2O.sub.5. A liquidus viscosity of the glass-ceramic composition may be greater than 35 kP. The glass-ceramic composition may be used to form the glass clad layer(s) of a laminated glass article.

According to one embodiment, a glass-ceramic composition may include from about 60 mol. % to about 75 mol. % SiO.sub.2; from about 5 mol. % to about 10 mol. % Al.sub.2O.sub.3; from about 2 mol. % to about 20 mol. % alkali oxide R.sub.2O, the alkali oxide R.sub.2O including Li.sub.2O and Na.sub.2O; and from 0 mol. % to about 5 mol. % alkaline earth oxide RO, the alkaline earth oxide RO including MgO. A ratio of Al.sub.2O.sub.3 (mol. %) to the sum of (R.sub.2O (mol. %)+RO (mol. %)) may be less than 1 in the glass-ceramic composition. A major crystalline phase of the glass-ceramic composition may be Li.sub.2Si.sub.2O.sub.5. A liquidus viscosity of the glass-ceramic composition may be greater than 35 kP. The glass-ceramic composition may be used to form the glass clad layer(s) of a laminated glass article.

An antenna packaged substrate includes: a substrate, a first antenna radiating patch disposed on a surface of the substrate, a second antenna radiating patch disposed over the first antenna radiating patch, and a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch. The dielectric stack includes a first dielectric layer, a bonding layer disposed on a side that is of the first dielectric layer and faces the first antenna radiating patch, and a second dielectric layer disposed on a side that is of the first dielectric layer and faces the second antenna radiating patch. A dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer.

A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C..Math.cm.sup.2/W or less.

A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C..Math.cm.sup.2/W or less.