The present disclosure relates to a thermoplastic film that includes a layer of thermoplastic material and a color indicator applied to the thermoplastic material. The color indicator can be configured to change color in response to a trigger. For example, the color indicator can change color (e.g., change from a first color to a second color) in response to a color change trigger, such as exposure to malodor particles, absorption of moisture, a length of time, or as a result of oxidation. In one or more embodiments, the thermoplastic film further includes an odor control component configured to mask, neutralize, or otherwise control malodors. The color indicator can change its color appearance as the odor control component performs to control any present malodors, thus signaling the performance of the odor control component.

A display device a plurality of display modules, each of the plurality of display modules including: a substrate having a mounting surface and a rear surface opposite the mounting surface; a plurality of inorganic light emitting diodes provided on the mounting surface of the substrate; and a frame supporting the plurality of display modules arranged in a matrix, the frame including: a first frame layer contacting the plurality of display modules and including a material having material properties similar to material properties of the substrate; a second frame layer provided behind the first frame layer, and including a metal material; and a third frame layer provided between the first frame layer and the second frame layer and bonding the first frame layer and the second frame layer.

A display device a plurality of display modules, each of the plurality of display modules including: a substrate having a mounting surface and a rear surface opposite the mounting surface; a plurality of inorganic light emitting diodes provided on the mounting surface of the substrate; and a frame supporting the plurality of display modules arranged in a matrix, the frame including: a first frame layer contacting the plurality of display modules and including a material having material properties similar to material properties of the substrate; a second frame layer provided behind the first frame layer, and including a metal material; and a third frame layer provided between the first frame layer and the second frame layer and bonding the first frame layer and the second frame layer.

The present disclosure provides for a multilayer film having a sealant layer and a first layer, where the first layer is formed from a first polyolefin composition, and a laminate that includes the multilayer film. The first polyolefin composition of the first layer consists essentially of a high density polyethylene (HDPE) resin and a propylene-ethylene copolymer thermoplastic elastomer (TPE). In addition to the first layer of the first polyolefin composition and the sealant layer, the laminate also includes a substrate film and an adhesive layer comprising polyurethane in adhering contact with the substrate film and the first layer, where when the adhesive layer is formed from a solvent-free adhesive the adhesive layer has an elastic modulus of greater than 25 MPa, and when the adhesive layer is formed from a solvent-based adhesive the adhesive layer has an elastic modulus of greater than 0.30 MPa, the elastic modulus being measured for the polyurethane in accordance with ASTM D412.

The present disclosure provides for a multilayer film having a sealant layer and a first layer, where the first layer is formed from a first polyolefin composition, and a laminate that includes the multilayer film. The first polyolefin composition of the first layer consists essentially of a high density polyethylene (HDPE) resin and a propylene-ethylene copolymer thermoplastic elastomer (TPE). In addition to the first layer of the first polyolefin composition and the sealant layer, the laminate also includes a substrate film and an adhesive layer comprising polyurethane in adhering contact with the substrate film and the first layer, where when the adhesive layer is formed from a solvent-free adhesive the adhesive layer has an elastic modulus of greater than 25 MPa, and when the adhesive layer is formed from a solvent-based adhesive the adhesive layer has an elastic modulus of greater than 0.30 MPa, the elastic modulus being measured for the polyurethane in accordance with ASTM D412.

Provided are: a laminated resin sheet for molding, which is less likely to cause an abnormal appearance during molding, and has an anti-glare layer but has excellent transparency; and a molded article using the same. This laminated resin sheet for molding comprises: a high-hardness resin layer containing a high-hardness resin; a base material layer which contains a polycarbonate resin (a1) and is disposed on one surface side of the high-hardness resin layer; and a hard coat anti-glare layer disposed on the other surface side of the high-hardness resin layer, wherein the glass transition point (Tg1) of the high-hardness resin and the glass transition point (Tg2) of the polycarbonate resin (a1) satisfy the following relationship, and the maximum valley depth (Rv) of the recesses and protrusions of the hard coat anti-glare layer is at most 0.9 μm.

−10° C.≤(Tg1−Tg2)≤40° C.

Provided are: a laminated resin sheet for molding, which is less likely to cause an abnormal appearance during molding, and has an anti-glare layer but has excellent transparency; and a molded article using the same. This laminated resin sheet for molding comprises: a high-hardness resin layer containing a high-hardness resin; a base material layer which contains a polycarbonate resin (a1) and is disposed on one surface side of the high-hardness resin layer; and a hard coat anti-glare layer disposed on the other surface side of the high-hardness resin layer, wherein the glass transition point (Tg1) of the high-hardness resin and the glass transition point (Tg2) of the polycarbonate resin (a1) satisfy the following relationship, and the maximum valley depth (Rv) of the recesses and protrusions of the hard coat anti-glare layer is at most 0.9 μm.

−10° C.≤(Tg1−Tg2)≤40° C.

In an embodiment, an article comprises a plurality of structural units, wherein each structural unit comprises a first portion; a second portion; wherein the second portion contacts the first portion; and a third portion; wherein the third portion is in communication with the first portion and the second portion and is more compressible than the first portion and the second portion; where the first portion has a first value of a property and where the second portion has a second value of the same property, such that the first value acts as a restraining or enhancing force on the second value; wherein the first portion comprises a first metal and wherein the second portion comprises a second metal that is different from the first metal.

In an embodiment, an article comprises a plurality of structural units, wherein each structural unit comprises a first portion; a second portion; wherein the second portion contacts the first portion; and a third portion; wherein the third portion is in communication with the first portion and the second portion and is more compressible than the first portion and the second portion; where the first portion has a first value of a property and where the second portion has a second value of the same property, such that the first value acts as a restraining or enhancing force on the second value; wherein the first portion comprises a first metal and wherein the second portion comprises a second metal that is different from the first metal.

Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.