B32B7/027

Ceiling panel for suspended ceilings
11697267 · 2023-07-11 ·

A ceiling panel for use in a gridwork of a suspended ceiling is provided. The ceiling panel includes a layer of foam insulation. A first facing sheet is positioned on a lower major face of the layer of foam insulation and a second facing sheet is positioned on an upper major face of the layer of foam insulation. A surface covering layer is positioned on an exposed face of the first facing sheet.

PLASMA RESISTANT CERAMIC BODY FORMED FROM MULTIPLE PIECES
20230212082 · 2023-07-06 ·

Disclosed is a joined ceramic body comprising a first ceramic portion comprising a first ceramic, a second ceramic portion comprising a second ceramic, and a joining layer formed between the first ceramic portion and the second ceramic portion. The joining layer has a bond thickness of from 0.5 to 20 um and comprises silicon dioxide having a total impurity content of 20 ppm and less. A method of making the joined ceramic body and a joining material are also disclosed.

PLASMA RESISTANT CERAMIC BODY FORMED FROM MULTIPLE PIECES
20230212082 · 2023-07-06 ·

Disclosed is a joined ceramic body comprising a first ceramic portion comprising a first ceramic, a second ceramic portion comprising a second ceramic, and a joining layer formed between the first ceramic portion and the second ceramic portion. The joining layer has a bond thickness of from 0.5 to 20 um and comprises silicon dioxide having a total impurity content of 20 ppm and less. A method of making the joined ceramic body and a joining material are also disclosed.

Thermal enclosure

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

Thermal enclosure

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

Manufacturing a concentrating sub-module comprising a heat-dissipating material

A method for manufacturing a concentrating photovoltaic solar sub-module equipped with a reflective face having a concave predefined geometric shape, wherein it includes laminating, in a single step, a multi-layer assembly comprising in succession: a structural element equipped with a reflective first face and a second face, opposite the first; a layer of a material of good thermal conductivity, higher than that of the material from which the structural element is composed, the layer being placed on the second face of the structural element; a layer of encapsulant or of adhesive; a photovoltaic receiver, the layer of encapsulant or of adhesive being placed between the layer of a material of good thermal conductivity and the receiver; a layer made of transparent encapsulating material, covering at least the entire surface of the photovoltaic receiver; and a transparent protective layer covering the layer made of transparent encapsulating material; and during the lamination, the reflective face of the structural element is shaped by being brought into contact with a convex surface of a counter-mold, in order to obtain the reflective face of concave predefined geometric shape.

Phase change material composition and method of preparation thereof

The present disclosure relates to a phase change material (PCM) composition and a process for preparation thereof, wherein said composition comprising a phase change material, glass fibers and xanthan gum. In a preferred embodiment, the phase change material is water (or ice) and the g lass fibers are glass wool. The disclosure also relates to a stackable and sealable package enclosing the PCM composition. In a particular embodiment, the PCM composition is used to prepare a cold box that may be used in cold chain transportation.

Phase change material composition and method of preparation thereof

The present disclosure relates to a phase change material (PCM) composition and a process for preparation thereof, wherein said composition comprising a phase change material, glass fibers and xanthan gum. In a preferred embodiment, the phase change material is water (or ice) and the g lass fibers are glass wool. The disclosure also relates to a stackable and sealable package enclosing the PCM composition. In a particular embodiment, the PCM composition is used to prepare a cold box that may be used in cold chain transportation.

Bend inducible self-folding Origami flexures and microsystems

The present disclosure relates to a spatio-temporal stimulus responsive foldable structure. The structure may have a substrate having at least a region formed to provide engineered weakness to help facilitate bending or folding of the substrate about the region of engineered weakness. The substrate is formed to have a first shape. A stimulus responsive polymer (SRP) flexure is disposed at the region of engineered weakness. The SRP flexure is responsive to a predetermined stimulus actuation signal to bend or fold in response to exposure to the stimulus actuation signal, to cause the substrate to assume a second shape different from the first shape.

Bend inducible self-folding Origami flexures and microsystems

The present disclosure relates to a spatio-temporal stimulus responsive foldable structure. The structure may have a substrate having at least a region formed to provide engineered weakness to help facilitate bending or folding of the substrate about the region of engineered weakness. The substrate is formed to have a first shape. A stimulus responsive polymer (SRP) flexure is disposed at the region of engineered weakness. The SRP flexure is responsive to a predetermined stimulus actuation signal to bend or fold in response to exposure to the stimulus actuation signal, to cause the substrate to assume a second shape different from the first shape.