B32B7/027

Decorative film and method for producing decorative molded body using same

This decorative film is to be bonded to a resin molded body by means of thermoforming, and comprises a sealing layer (I) that contains a polypropylene resin (A) and a layer (II) that contains a polypropylene resin (B). The polypropylene resin (A) satisfies the requirement (a1), while the polypropylene resin (B) satisfies the requirement (b1). (a1) The melt flow rate (MFR (A)) (at 230° C. under a load of 2.16 kg) is more than 0.5 g/10 minutes. (b1) The melt flow rate (MFR (B)) (at 230° C. under a load of 2.16 kg) and the MFR (A) satisfy relational expression (b-1). MFR (B)<MFR (A) (b-1).

TRANSPARENT CONDUCTING FILM LAMINATE AND PROCESSING METHOD THEREOF
20220371310 · 2022-11-24 · ·

Provided are a transparent conducting film laminate capable of controlling a curl during and after the heating, and a processing method thereof. A transparent conducting film laminate comprising a transparent conducting film 10, and a carrier film 1 stacked on the transparent conducting film 10, wherein the carrier film is a polycarbonate film having no adhesive agent layer, the transparent conducting film 10 comprises a transparent resin film 2, a transparent conducting layer 3 containing metal nanowires and a binder resin, and an overcoat layer 4 stacked in this order, the transparent resin film 2 is made of an amorphous cycloolefin-based resin, and the carrier film to be releasably stacked on a main face of the transparent conducting film 2, the main face being opposite to the face on which the transparent conducting layer 3 is stacked.

TRANSPARENT CONDUCTING FILM LAMINATE AND PROCESSING METHOD THEREOF
20220371310 · 2022-11-24 · ·

Provided are a transparent conducting film laminate capable of controlling a curl during and after the heating, and a processing method thereof. A transparent conducting film laminate comprising a transparent conducting film 10, and a carrier film 1 stacked on the transparent conducting film 10, wherein the carrier film is a polycarbonate film having no adhesive agent layer, the transparent conducting film 10 comprises a transparent resin film 2, a transparent conducting layer 3 containing metal nanowires and a binder resin, and an overcoat layer 4 stacked in this order, the transparent resin film 2 is made of an amorphous cycloolefin-based resin, and the carrier film to be releasably stacked on a main face of the transparent conducting film 2, the main face being opposite to the face on which the transparent conducting layer 3 is stacked.

WEDGE-SHAPED MULTI-LAYER INTERLAYER WITH OUTER SKIN LAYERS OF VARYING THICKNESS

Multiple layer interlayers having enhanced optical and acoustic properties are provided, along with methods of making and using the same. Interlayers as described herein may include at least two outer skin layers and an inner core layer, with one of the outer skin layers having a different thickness than the other at one or more locations along the interlayer. The multi-layer interlayer may also exhibit acoustic properties and, in some cases, may have an overall wedged thickness profile. Additionally, in some aspects, interlayers and laminates formed therefrom may also provide reduced infrared energy transmission, without sacrificing acoustic and/or optical performance.

WEDGE-SHAPED MULTI-LAYER INTERLAYER WITH OUTER SKIN LAYERS OF VARYING THICKNESS

Multiple layer interlayers having enhanced optical and acoustic properties are provided, along with methods of making and using the same. Interlayers as described herein may include at least two outer skin layers and an inner core layer, with one of the outer skin layers having a different thickness than the other at one or more locations along the interlayer. The multi-layer interlayer may also exhibit acoustic properties and, in some cases, may have an overall wedged thickness profile. Additionally, in some aspects, interlayers and laminates formed therefrom may also provide reduced infrared energy transmission, without sacrificing acoustic and/or optical performance.

Polyolefin microporous film and lithium-ion secondary cell in which same is used

A polyolefin microporous film having a laminated structure provided with at least one layer A containing a polyolefin and at least one layer B containing a polyolefin. 0 mass % to less than 3 mass % of polypropylene is contained in layer A and 1 mass % to less than 30 mass % of polypropylene is contained in layer B. When the proportion of polypropylene contained in layer A is represented by PPA (mass %) and the proportion of polypropylene contained in layer B is represented by PPB (mass %), PPB>PPA. In the polyolefin microporous film, the heat shrinkage ratio in TD at 120° C. measured upon applying, in MD, a constant load determined on the basis of the relationship: load (gf)=0.01×piercing strength (gf) of polyolefin microporous film×length (mm) in TD of polyolefin microporous film, is 10 to 40% inclusive.

Resin member, resin molded body, cartridge, image forming apparatus, and method for manufacturing resin member
11590740 · 2023-02-28 · ·

A resin member includes a base material and a resin molded body disposed on the base material, the resin molded body containing a main component constituted by an ethylene-vinyl acetate copolymer resin and a carbon black. The resin molded body has two or more peaks within a range of 25° C. to 80° C. in an endothermic curve obtained through measurement performed by heating from 25° C. to 150° C. at 5° C./min with a differential scanning calorimetry (DSC) apparatus.

BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRIC VEHICLE
20230059574 · 2023-02-23 ·

A battery, a battery module, a battery pack, and an electric vehicle are provided. The battery includes a metal shell and a plurality of electrode core assemblies sealed in the metal shell and arranged in sequence. The electrode core assemblies are connected in series. Each of the electrode core assemblies includes at least one electrode core. The electrode core assemblies are sealed in a packaging film. An air pressure between the metal shell and the packaging film is lower than an air pressure outside the metal shell. An air pressure inside the packaging film is lower than the air pressure between the metal shell and the packaging film.

BIODEGRADABLE AND COMPOSTABLE FILM WITH AN INCREASED BARRIER EFFECT TO AERIFORM FLUIDS
20220363040 · 2022-11-17 ·

Disclosed is a biodegradable, compostable and thermoshrinking film for packaging perishable goods, including a base structure substantially permeable to light radiation and including a first layer 10 μm thick, to directly contact the goods, and consisting of 89% in weight Mater-Bi® EF51L, 10% in weight BioGranic™ 3112 and 1% in weight Mater-B® master MEE. A second layer, overlapping the first, has a thickness equal to the one of the first layer and consists of 50% in weight Mater-Bi® EF51L and 50% in weight Mater-Bi® DF51A0. A third layer, overlapping the second, has a thickness equal to the one of the first layer and consists of 99% in weight Mater-Bi® EF51L and 1% in weight Mater-Bi® master MEE. A barrier layer including aluminum and/or aluminum oxide and/or silicon oxide and having a thickness ≤0.1 μm overlaps the third layer.

BIODEGRADABLE AND COMPOSTABLE FILM WITH AN INCREASED BARRIER EFFECT TO AERIFORM FLUIDS
20220363040 · 2022-11-17 ·

Disclosed is a biodegradable, compostable and thermoshrinking film for packaging perishable goods, including a base structure substantially permeable to light radiation and including a first layer 10 μm thick, to directly contact the goods, and consisting of 89% in weight Mater-Bi® EF51L, 10% in weight BioGranic™ 3112 and 1% in weight Mater-B® master MEE. A second layer, overlapping the first, has a thickness equal to the one of the first layer and consists of 50% in weight Mater-Bi® EF51L and 50% in weight Mater-Bi® DF51A0. A third layer, overlapping the second, has a thickness equal to the one of the first layer and consists of 99% in weight Mater-Bi® EF51L and 1% in weight Mater-Bi® master MEE. A barrier layer including aluminum and/or aluminum oxide and/or silicon oxide and having a thickness ≤0.1 μm overlaps the third layer.