A film material formed of thermoplastic polymer material is processed so as to have linearly extending regions (A) linked together by linearly extending webs (B), regions (A) and webs (B) each being oriented, the dominant direction of orientation in regions (A) forming an angle (V) to the direction on which (A) extends and webs (B) comprising arrays of linear furrows of thinner material or splits forming angles (U) higher than (V) to the direction in which (A) extends. The method of producing the new film involves passing an orientated film through a pair of intermeshing grooved rollers to cold-stretch the film in a direction at an angle to the predominant original orientation, at least one of the grooved rollers having crests with sharp edges to form the division between regions A and webs B and to stretch the material to form webs B while stretching the material less or not at all to form regions A. Preferably at least one of the grooved rollers has crests with a waved surface shape.

Crosslaminates of thermoplastic films have at least one of the films formed as a fluted structure, and two films are laminated to one another in such a manner that pockets are formed which contain gas. The pockets allow passage of gas between at least two adjacent flutes, whereby the product has an improved handle, and bags formed of the laminate have good stacking properties when filled with coarse particulates. The flute pitch is generally no more than 3 mm, while the pocket length is less than 50 mm. The bonding method involves spot bonding between the films, achieved by adhering the films together between crown portions of bosses on one film with molten material on the other film under a low pressure process, for instance achieved by provision of air pressure through adaptation of production apparatus, for instance die portions.

A film for a composite article may include a non-weakened portion and a weakened portion. The weakened portion may have at least one property that may be lower than the property of the non-weakened portion.

The present invention discloses a two-layer composite wood floor board, comprising a face plate and a base plate, wherein the face plate is disposed above the base plate, the face plate is glued to the base plate, the base plate is formed by peeling a log, the lower part of the base plate is provided with more than one grooves, and reinforcing ribs are disposed in part or all of the grooves. The present invention has the following advantageous effects: on one hand, the area of a single base material formed by peeling is larger so that the number of gluing is reduced for manufacturing a floor board having the same area, thereby greatly reducing adhesive consumption, and meanwhile, the increase of the outturn percentage of the log and the simplification of the machining process are achieved by manufacturing the base plate through peeling, thereby greatly improving the production efficiency.

The present invention is directed to a multilayer structure. More specifically, the present invention is directed to a polypropylene multilayer extrusion laminate structure which provides sufficient thermal resistance and mechanical properties, and which multilayer structure can be recycled. The present invention is further directed to a process for producing the multilayer structure by an extrusion lamination process.

The present invention is directed to a multilayer structure. More specifically, the present invention is directed to a polypropylene multilayer extrusion laminate structure which provides sufficient thermal resistance and mechanical properties, and which multilayer structure can be recycled. The present invention is further directed to a process for producing the multilayer structure by an extrusion lamination process.

A conductive film includes a substrate and a first metal nanowire layer. The first metal nanowire layer is disposed on a first surface of the substrate. The first metal nanowire layer has an anisotropy value larger than or equal to 2.8 and smaller than or equal to 4.0.

A conductive film includes a substrate and a first metal nanowire layer. The first metal nanowire layer is disposed on a first surface of the substrate. The first metal nanowire layer has an anisotropy value larger than or equal to 2.8 and smaller than or equal to 4.0.

A conductive film includes a substrate and a first metal nanowire layer. The first metal nanowire layer is disposed on a first surface of the substrate. The first metal nanowire layer has an anisotropy value larger than or equal to 2.8 and smaller than or equal to 4.0.

A conductive film includes a substrate and a first metal nanowire layer. The first metal nanowire layer is disposed on a first surface of the substrate. The first metal nanowire layer has an anisotropy value larger than or equal to 2.8 and smaller than or equal to 4.0.