Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

The invention relates to an insulated panel, in particular a wall panel or roof panel, including a foamed core layer and a cover layer affixed to the foamed core layer. The invention also relates to an insulating covering, in particular a wall covering or floor covering, including a plurality said insulated panels.

The invention relates to an insulated panel, in particular a wall panel or roof panel, including a foamed core layer and a cover layer affixed to the foamed core layer. The invention also relates to an insulating covering, in particular a wall covering or floor covering, including a plurality said insulated panels.

Described herein is a recyclable packaging having an exposed outermost surface, the recyclable packaging comprising: a wall comprising an inner surface opposite an outer surface, the wall having a multi-layer structure that includes a first layer comprising biaxially oriented polypropylene, a second layer comprising metallized cast polypropylene, a third layer comprising cast polypropylene; and a cavity at least partially surrounded by the wall.

A vehicle laminated glazing includes a first extraclear glass sheet (exterior glazing), a lamination interlayer and a second glass or plastic sheet (interior glazing) with a traversing hole.

A vehicle laminated glazing includes a first extraclear glass sheet (exterior glazing), a lamination interlayer and a second glass or plastic sheet (interior glazing) with a traversing hole.

The invention relates to a laminate (10; 10a) having a core (12) containing a thermoplastic polymer and having metal cover layers (16) disposed on either side of the core (12), each cover layer (16) being connected to the core (12) via an adhesive layer (14) having at least one polymer layer (15).

The invention relates to a laminate (10; 10a) having a core (12) containing a thermoplastic polymer and having metal cover layers (16) disposed on either side of the core (12), each cover layer (16) being connected to the core (12) via an adhesive layer (14) having at least one polymer layer (15).

Disclosed is a bonded assembly comprising at least: a first substrate, a second substrate, an intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which cavities are provided so that the intermediate deformation layer has a stiffness which is variable along a direction parallel to the intermediate deformation layer, an adhesive between the intermediate layer and the second substrate.