Systems and methods are provided for simulating traction power and control in transportation systems under design conditions and/or utilizing real-time data.

This invention relates to devices integrally comprising fibres that have emissivities, particularly of infrared radiation, that can be controllably varied. The active emissive surface comprises graphene layers with intercalated ions.

3D printers and novel polymeric laminates for use in 3D printers. The novel laminates comprise a first layer composed of a PMP polymer, a PPO polymer or the like and a second layer composed of an amorphous fluoropolymer.

A composite molded cargo body panel including a core, an interior skin secured to a first side of the core having a thickness, and exterior skin secured to a second side of the core, and a plurality of recesses. The plurality of recesses are dispersed along a first direction at intervals in the interior skin, with the core thickness at each of the plurality of recesses being reduced compared to a maximum core thickness, and each of the plurality of recesses defines a support surface. A pocket is formed in each of the plurality of recesses, with the core thickness at the pocket being less than the core thickness at each of the plurality of recesses. A plurality of logistics inserts are attached to the respective support surfaces of the plurality of recesses so that, at each of the plurality of recesses, the logistics insert extends across the pocket.

The present invention addresses the problem of providing a desiccant that can be used for passivation of an electronic device such as an organic electroluminescence element against moisture permeation, as well as an organic thin film including the desiccant, an organic layered film in which the organic thin film is layered, and an electronic device that is provided therewith. This desiccant is characterized by including a compound that emits a hydrophobic substance by absorbing water. This organic thin film is characterized by including this desiccant.

A floor element for forming a floor covering, the floor element comprising a decorative layer comprising a ceramic material, an intermediate layer comprising a resin material, and a support layer arranged below the decorative layer, wherein the support layer comprises edges provided with coupling elements configured to realize a mechanical coupling with coupling elements of an adjacent floor element and wherein the resin material comprises a modulus of elasticity greater than 0.1 GPa, preferably greater than 0.5 GPa, even more preferably greater than 1 GPa.

A method of manufacturing a thin film is provided. The method includes providing a plurality of crystalline hexagonal tungsten trioxide particles, size-reducing the crystalline hexagonal tungsten trioxide particles by grinding to produce crystalline hexagonal tungsten trioxide nanostructures, and coating the crystalline hexagonal tungsten trioxide nanostructures onto a substrate to produce a thin film. An electrochromic multi-layer stack is also provided.

A reinforced sandwich panel, including two skin panels; a foam core disposed between the two skin panels; and an expandable framework disposed within the foam core.

A game token by which a plurality of RFID tags embedded in a plurality of the game tokens stacked each other can be read in a relatively stable manner is provided. A game token is provided with a security part and a receiving part that receives the security part. The security part has a shape with a diameter smaller than the diameter of the receiving part, a structure with a plurality of plastic layers laminated together, an RFID tag, and a visible print layer indicating a type or ID of the game token. The receiving part has a surface. The surface of the receiving part has a recessed portion for receiving the security part, and the depth of the recessed portion is 25% or more of the thickness of the game token.

An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.