A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/μm or more and 1000% by mass/μm or less.

The present document discloses a glazing in the form of a window glass or vehicle glass which comprises a transparent substrate, and a coating. The coating comprises, in order outward from the transparent substrate, an optional diffusion barrier layer, a first anti-reflective layer, an optional first seed layer, a first functional metal layer, at least one optional first blocker layer, a second anti-reflective layer, an optional second seed layer, a second functional metal layer, at least one optional second blocker layer, a third anti-reflective layer, and an optional top layer, wherein at least one of the first functional metal layer and the second functional metal layer comprises a Ag alloy consisting essentially of Ag with an alloying agent selected from a group consisting of Li, C, Na, Mg, Si, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Ge, Sr, Y, Zr, Nb, Mo, Rh, Pd, In, Sn, Sb, Hf, Ta, W, Pt or Au.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

A composite membrane for hydrogen separation and purification, including: a modified and activated support, a Palladium (Pd) layer, and an interstice layer between the second surface-modifying layer and the Pd layer. The support includes a support substrate, a first surface-modifying layer on the support substrate, and a second surface-modifying layer on the first surface-modifying layer.

This hermetic sealing lid member (1) is made of a clad material (10) including a base material layer (11) made of an Fe alloy that contains 4 mass % or more of Cr and a silver brazing layer (13) bonded onto a surface of the base material layer on a side closer to an electronic component housing member through an intermediate layer (12).

An electric contact pair includes a first electric contact, and a second electric contact to be brought into electrical contact with the first electric contact. The first electric contact includes a first plating film made of Ag or a Ag alloy on its outermost surface, and the second electric contact includes a second plating film made of Rh or a Rh alloy on its outermost surface. The first plating film maybe layered on a first conductive base material, the second plating film maybe layered on a second conductive base material, and the first conductive base material and the second conductive base material are made of copper or a copper alloy, or aluminum or an aluminum alloy. A connector terminal pair includes a first terminal including the first electric contact, and a second terminal including the second electric contact.

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

A coating made of platinum-gold alloy is provided, together with a method of its preparation by electrodeposition. The alloy is composed of more than 50 atomic percent platinum. The microstructure of the alloy consists of generally ellipsoidal grains. More than half of the grains have a major axis of 10 nm or less.

A tip including an alloy of platinum and an alloying element chosen from gold, palladium, ruthenium, osmium, iron, cobalt, nickel, copper, zinc, silver, chromium, manganese, titanium, niobium, scandium, vanadium, yttrium, zirconium, molybdenum, tantalum, tungsten, technetium, cadmium, hafnium, rhenium, less than 5 wt. % of iridium, less than 5 wt. % of rhodium, greater than 20 wt. % iridium, greater than 20 wt. % rhodium, and a combination thereof, relative to the total weight of the alloy is disclosed. An interface cone can include a base and the tip.

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.