A packaging material comprising a graphene-reinforced polymer matrix composite (G-PMC) is disclosed. The packaging material has improved barrier resistance to gas and liquid permeants. Also disclosed is a method of improving barrier resistance of a polymer to a permeant, the method comprising forming a graphene-reinforced polymer matrix composite within the polymer. The packaging material may be used for packaging food, drug, perfume, etc. and to make various containers.

A method of making a feed-thru connector assembly includes inserting a conductor within an opening within a housing of a pulse generator and dispensing a sealant in a gap between the conductor and portions of the housing adjacent to the conductor that define the opening of the housing and curing the sealant to form a seal comprising a polyisobutylene cross-linked network.

A method of making a feed-thru connector assembly includes inserting a conductor within an opening within a housing of a pulse generator and dispensing a sealant in a gap between the conductor and portions of the housing adjacent to the conductor that define the opening of the housing and curing the sealant to form a seal comprising a polyisobutylene cross-linked network.

Methods of making bearings using pressure sensitive macromolecular adhesive polymers and pressure sensitive polymer compositions capable of integrating fluoropolymeric properties with a catecholamine functionality to form an adhesive system that allows bonding between metallic substrates and fluoropolymers are disclosed. Also disclosed are core-shell polymeric particles comprised of a core and a shell comprising a thermoplastic polydopamine polymer that may be prepared as a colloidal suspension and used as a hot-melt pressure sensitive adhesive capable of binding low surface energy materials, such as polyolefins and fluoropolymers, to diverse materials including metals in making bearings and/or bearing components.

A concrete construction made by 3D concrete printing having two or more layers of cementitious material extruded one above the other, and a reinforcing structure reinforcing the two or more layers. The reinforcing structure has at least two flexible longitudinal elongated steel elements running in lengthwise direction, and one or more flexible transverse steel elements forming an angle with the lengthwise direction so that these flexible transverse steel elements are present in the two or more layers. The structure also has a positioning element for positioning the at least two flexible longitudinal elongated elements and the flexible transverse steel elements, a polymer coating or yarns making stitches. The polymer coating or the stitches are applied on the at least two flexible longitudinal elongated steel elements, on the flexible transverse steel elements and on the positioning element thereby making a bond.

A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes 2 wt % to 40 wt % of a liquid rubber, 5 wt % to 60 wt % of a polyphenylene ether resin, 3 wt % to 40 wt % of a crosslinker, and 5 wt % to 40 wt % of a phosphorus flame retardant. A structural formula of the phosphorus flame retardant is shown as Formula (I):

##STR00001##

A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes 2 wt % to 40 wt % of a liquid rubber, 5 wt % to 60 wt % of a polyphenylene ether resin, 3 wt % to 40 wt % of a crosslinker, and 5 wt % to 40 wt % of a phosphorus flame retardant. A structural formula of the phosphorus flame retardant is shown as Formula (I):

##STR00001##

An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same are provided. The encapsulation film has excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending caused by CTE mismatch, and overcomes the performance decrease due to reliability degradation, while preventing generation of bright spots in the organic electronic device.

The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises (a) a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content of 2 to 21 weight percent based on the weight of the copolymer, wherein the amount of copolymer (a) comprises 20-80 weight percent of the blend based on the total weight of the blend, and (b) a copolymer comprising ethylene and at least one of methyl acrylate and ethyl acrylate having an acrylate content of 5 to 30 weight percent based on the weight of the copolymer, wherein the amount of copolymer (b) comprises 10 to 50 weight percent of the blend based on the total weight of the blend, wherein the amount of copolymer (a) and copolymer (b) is at least 70 weight percent of the blend based on the total weight of the blend.

The present invention is directed to a gypsum board and a method of making such gypsum board. In one embodiment, the gypsum board comprises a gypsum core including a first gypsum core layer and a second gypsum core layer sandwiching a laminate layer. The laminate layer comprises two outer laminate layers sandwiching an inner laminate layer, wherein the two outer laminate layers have a higher elastic modulus than the inner laminate layer. The method of making the gypsum board includes steps of providing facing materials and corresponding gypsum slurries wherein the laminate layer is provided in-line during the manufacturing process of the gypsum board.