A method for preparing rigid polyurethane (PUR) foams or rigid polyisocyanurate (PIR) foams in which method the rigid PUR or PIR foam is prepared by reacting a composition (C) comprising: at least one isocyanate-reactive component (B1) having functional groups selected from hydroxyl, amine and thiol groups; at least one isocyanate component (A1) having an average functionality of less than 2.70; and at least one blowing agent [blowing agent (BA), herein after]; with the proviso that the overall average functionality [F.sub.n,avg(A), herein after] of all isocyanate components present in the composition (C) is less than 2.70; wherein the composition (C) is characterized by an isocyanate index X, wherein the rigid PUR or PIR foams are produced by depositing the composition (C) between two gas-tight facing sheets and wherein the rigid PUR or PIR foam is characterized by a difference Δλ between the initial thermal conductivity value λ.sub.ini and the aged thermal conductivity value λ.sub.aged of said rigid PUR or PIR foam wherein: when X≤200 then Δλ<1.35; and when X>200 then Δλ<[6.49−(4.46*F.sub.n,avg(A))−(0.02348*X)+(0.492*F.sub.n,avg(A)*F.sub.n,avg(A))+(0.01343*F.sub.n,avg(A)*X)+0.3].

An object of the present invention is to provide a laminated sheet for a metal-clad laminate and a method of manufacturing the same, the laminated sheet including: a substrate that includes a liquid crystal polymer or a fluoropolymer; and an adhesive layer, in which adhesiveness with a metal layer formed on the adhesive layer is excellent. Another object of the present invention is to provide a metal-clad laminate and a method of manufacturing the same.

A laminated sheet for a metal-clad laminate includes: a substrate that includes a liquid crystal polymer or a fluoropolymer; an inorganic oxide layer; and an adhesive layer, in which the substrate, the inorganic oxide layer, and the adhesive layer are laminated in this order.

An object of the present invention is to provide a laminated sheet for a metal-clad laminate and a method of manufacturing the same, the laminated sheet including: a substrate that includes a liquid crystal polymer or a fluoropolymer; and an adhesive layer, in which adhesiveness with a metal layer formed on the adhesive layer is excellent. Another object of the present invention is to provide a metal-clad laminate and a method of manufacturing the same.

A laminated sheet for a metal-clad laminate includes: a substrate that includes a liquid crystal polymer or a fluoropolymer; an inorganic oxide layer; and an adhesive layer, in which the substrate, the inorganic oxide layer, and the adhesive layer are laminated in this order.

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

A deployable Kiriform flexure includes first and second sections. The first section of the Kiriform flexure includes a plurality of curved fins arranged about a central axis. The second section of the Kiriform flexure includes a plurality of curved fins arranged about a central axis. Each fin of the second section is joined with a fin of the first section such that the first and second sections share a common central axis in a configuration that produces out-of-plane elastic buckling of the fins to actuate the Kiriform flexure from a substantially flat structure that extends substantially only in two dimensions orthogonal to the central axis to an expanded structure extending substantially in a third dimension parallel to the central axis when at least one of the first and second sections is rotated relative to the other section.

The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

A method includes identifying a location of a locating feature disposed on an exterior profile of a lower substrate, the locating feature configured to identify a specified location of the exterior profile, positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature, and installing the self-piercing rivet through the upper substrate and into the lower substrate.

A method includes identifying a location of a locating feature disposed on an exterior profile of a lower substrate, the locating feature configured to identify a specified location of the exterior profile, positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature, and installing the self-piercing rivet through the upper substrate and into the lower substrate.