B32B15/08

INTERMEDIATE DEFORMATION LAYER WITH ADJUSTABLE MACROSCOPIC STIFFNESS FOR BONDED ASSEMBLY

Disclosed is a bonded assembly comprising at least: a first substrate, a second substrate, an intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which cavities are provided so that the intermediate deformation layer has a stiffness which is variable along a direction parallel to the intermediate deformation layer, an adhesive between the intermediate layer and the second substrate.

A MULTICHAMBER STRUCTURAL ELEMENT AND A MULTICHAMBER STRUCTURAL ELEMENT MANUFACTURING METHOD
20230037963 · 2023-02-09 · ·

The object of the invention is a multichamber structural element manufacturing method which for forming a multichamber structural element with chamber profiles (1) extending radially from the center defined by the connection of the chamber profiles (1) comprises the following steps: at least three chamber profile preforms (2) are provided, wherein each chamber profile preform (2) comprises two walls (3) made of a sheet of metal material and arranged with respect to each other in substantially parallel planes with a gap retained between them, wherein the edges of the individual walls (3) converge, and wherein a valve element (6) is arranged on at least one wall (3); the unconnected wall (3) edges of each of the chamber profile preforms (2) are sealed with a seal (5) for forming a closed hermetic empty inner space of the chamber profile preform (2); a fluid under pressure is introduced through the valve element (6) into the inner space of the chamber profile preform (2) for forming a deformed chamber profile (1), at least three chamber profile preforms (2) or chamber profiles (1) are connected in the area of the corresponding inner edges of the chamber profile preform (2) or the chamber profile (1), proximal with respect to the connection axis (4), along at least part of the inner edges. The object of the invention is also a multichamber structural element.

A MULTICHAMBER STRUCTURAL ELEMENT AND A MULTICHAMBER STRUCTURAL ELEMENT MANUFACTURING METHOD
20230037963 · 2023-02-09 · ·

The object of the invention is a multichamber structural element manufacturing method which for forming a multichamber structural element with chamber profiles (1) extending radially from the center defined by the connection of the chamber profiles (1) comprises the following steps: at least three chamber profile preforms (2) are provided, wherein each chamber profile preform (2) comprises two walls (3) made of a sheet of metal material and arranged with respect to each other in substantially parallel planes with a gap retained between them, wherein the edges of the individual walls (3) converge, and wherein a valve element (6) is arranged on at least one wall (3); the unconnected wall (3) edges of each of the chamber profile preforms (2) are sealed with a seal (5) for forming a closed hermetic empty inner space of the chamber profile preform (2); a fluid under pressure is introduced through the valve element (6) into the inner space of the chamber profile preform (2) for forming a deformed chamber profile (1), at least three chamber profile preforms (2) or chamber profiles (1) are connected in the area of the corresponding inner edges of the chamber profile preform (2) or the chamber profile (1), proximal with respect to the connection axis (4), along at least part of the inner edges. The object of the invention is also a multichamber structural element.

COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
20230040667 · 2023-02-09 · ·

The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 μm to 20 μm is in a range of 0.5 nL/mm.sup.2 or more and 5 nL/mm.sup.2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.

COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
20230040667 · 2023-02-09 · ·

The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 μm to 20 μm is in a range of 0.5 nL/mm.sup.2 or more and 5 nL/mm.sup.2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.

SUBSTRATE FOR A PRINTED WIRING BOARD

A substrate for a printed wiring board, the substrate includes a base film containing polyimide as a main component and a sinter layer disposed on at least a portion of a surface of the base film and containing copper nanoparticles. The base film contains a nitrogen atom bonded to a copper atom of the copper nanoparticles, an average number of the nitrogen atom bonded to the copper atom per unit area of the surface of the base film on which the sinter layer is disposed is 2.6×10.sup.18 atoms/m.sup.2 to 7.7×10.sup.18 atoms/m.sup.2, and the average number is an average number calculated for a measurement region estimated to have a thickness of 3 nm from a measurement value of the surface of the base film measured by X-ray photoelectron spectroscopy.

LAMINATE
20230042016 · 2023-02-09 · ·

An object of the present invention is to provide a laminate having a smaller transmission loss in a high frequency band.

A laminate having a metal layer and a resin layer in contact with at least one surface of the metal layer, in which a dielectric loss tangent of the resin layer at a temperature of 23° C. and a frequency of 28 GHz is less than 0.002, and an average length RSm at an interface between the metal layer and the resin layer in a cross-section along a thickness direction of the laminate is 1.2 μm or less.

BODY FOR ELECTRIC TWO-WHEELED VEHICLE
20230009828 · 2023-01-12 · ·

A body for an electric two-wheeled vehicle is proposed. More particularly, proposed is a body for an electric two-wheeled vehicle in which materials of different types are stacked to be light in the weight of the vehicle body, and space receiving a battery is defined to protect the battery and facilitate installation thereof. The body for an electric two-wheeled vehicle includes a frame part having a space part formed in a center part thereof, wherein in the frame part, first and second material layers of different types are alternately stacked to be coupled to each other such that the first and second material layers form multiple layers.

Wire, wire manufacturing method, and vehicle door

A wire including a wire body that is made of metal, and a protector that is made of resin, that covers an outer periphery of the wire body, and that is integrally molded with the wire body.

Article of Manufacture for Securing a Catalyst Substrate

An aftertreatment component for use in an exhaust aftertreatment system. The aftertreatment component comprises an aftertreatment substrate and a compressible material. The compressible material may be formed from a plastic thermoset, a rubberized material, or a metal foil which permits for the selective expansion of the substrate within the compressible material, while also reducing cost and manufacturing complexity. In various embodiments, the aftertreatment substrate and the compressible materials may be formed separately and coupled to each other, or they may be formed concurrently via coextrusion.