To provide a laminate excellent in the oil resistance without using a polypropylene film for the innermost layer of a packaging material.

A laminate comprising at least three layers (A), (B) and (C) in this order, wherein the layer (A) is composed of a polyolefin which satisfies the following requirements (a) to (c), the layer (B) is composed of an adhesive which satisfies the following requirements (d) to (f), and the layer (C) is a substrate comprising at least one layer: (a) density of from 900 to 970 kg/m.sup.3, (b) MFR of from 2 to 30 g/10 min, (c) film thickness of from 5 to 25 μm, (d) film thickness of from 0.01 to 3.0 μm, (e) glass transition temperature of from −30 to +10° C., and (f) storage modulus E′ at 20° C. of from 1.0×10.sup.6 to 2.5×10.sup.7 Pa

A seal laminate for closing a mouth of a container is provided. The seal laminate includes a heat seal layer, a structural base support layer and upper and lower dimensional stable layers. The heat seal layer bonds the laminate to a rim surrounding the container's mouth. The structural base support layer may be comprised of a pulp, paper, cardboard, chipboard, paperboard, or cellulose based material having a moisture content of about 3 to about 6 percent and is positioned above the heat seal layer. The upper and lower dimensionally stable layers are disposed above and below the structural base support layer and are sized to balance the vertical forces on the structural base support layer upon exposure to about 60 percent or greater relative humidity. The upper and lower dimensionally stable layers have a water vapor transmission rate of about 1.5 g/100 in.sup.2/24 hours or below.

A seal laminate for closing a mouth of a container is provided. The seal laminate includes a heat seal layer, a structural base support layer and upper and lower dimensional stable layers. The heat seal layer bonds the laminate to a rim surrounding the container's mouth. The structural base support layer may be comprised of a pulp, paper, cardboard, chipboard, paperboard, or cellulose based material having a moisture content of about 3 to about 6 percent and is positioned above the heat seal layer. The upper and lower dimensionally stable layers are disposed above and below the structural base support layer and are sized to balance the vertical forces on the structural base support layer upon exposure to about 60 percent or greater relative humidity. The upper and lower dimensionally stable layers have a water vapor transmission rate of about 1.5 g/100 in.sup.2/24 hours or below.

Provided are: a resin-containing sheet in which not only the mechanical strength of a cellulose nanofiber nonwoven fabric but also the flexural resistance of a substrate are improved; and a structure and a wiring board which include the same. The resin-containing sheet includes: a specific cellulose nanofiber nonwoven fabric (11); a fixing agent (2) which fixes together fibers (1) in the cellulose nanofiber nonwoven fabric (11); and a resin (3) which is in contact with the cellulose nanofiber nonwoven fabric (11) and the fixing agent (2), wherein the storage modulus of the fixing agent (2) is higher than that of the resin (3). The structure is obtained by tightly adhering the resin-containing sheet to a substrate. The wiring board includes this structure.

An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 μm and an average interval of 5 to 400 μm, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm.sup.2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.

An epoxy resin composition, and a prepreg, a laminate, and a metal foil-clad laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an optional inorganic filler (D), the high molecular weight resin (C) having the structure shown in formula (1), formula (2), formula (3), and formula (4), the weight-average molecular weight being between 100,000 and 200,000, and the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton being 0%. The present epoxy resin composition, and the prepreg, the laminate, and the metal foil-clad laminate manufactured using same have good heat resistance, low modulus, and a low coefficient of thermal expansion. The formulas are:

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Provided is a curable silicone composition for a release agent which can release a release film from a silicone adhesive with low release force without reducing the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film or laminate having the small release force of the silicone adhesive is also provided. The curable silicone composition comprises: (A) a mixture of two or more fluoroalkyl group-containing organopolysiloxanes having a fluoroalkyl group and at least two alkenyl groups per molecule, wherein the contents of the fluoroalkyl groups differ from each other, and the two or more fluoroalkyl group-containing organopolysiloxanes are a combination of those which are not completely compatibilized at 25° C. when mixed in the absence of a solvent; (B) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule; (C) an effective amount of a hydrosilylation reaction catalyst; and (D) an organic solvent.

A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

A cellular structure may include a plurality of cells each having a twelve-cornered cross section. The twelve-cornered cross section may include twelve sides and twelve corners creating eight internal angles and four external angles. Each cell may include a plurality of longitudinal walls extending between a top and a bottom of the cell, the longitudinal walls intersecting to create corners of the cell. A structural component may include at least one wall surrounding a component interior space with a cellular structure having at least two cells being positioned within the interior space. A sandwich structure may include first and second substantially planar structures, and a cellular structure with at least two cells positioned between the first and second substantially planar structures.

A cellular structure may include a plurality of cells each having a twelve-cornered cross section. The twelve-cornered cross section may include twelve sides and twelve corners creating nine internal angles and three external angles. Each cell may include a plurality of longitudinal walls extending between a top and a bottom of the cell, the longitudinal walls intersecting to create corners of the cell. A structural component may include at least one wall surrounding a component interior space with a cellular structure having at least two cells positioned within the interior space. A sandwich structure may include first and second planar structures, and a cellular structure positioned between the first and second substantially planar structures.