According to at least one feature of the present disclosure, a method of forming an optical element, includes: Depositing an aluminum layer atop a glass substrate via a physical deposition process; depositing a first fluorine containing layer atop the aluminum layer via a physical deposition process; depositing a second fluorine containing layer atop the first fluorine containing layer via a physical deposition process; and depositing a third fluorine containing layer atop the first fluorine containing layer via an atomic layer deposition process.

A transparent conductive film includes a metal oxide, a metal, and an epoxy, wherein a refractive index of the metal may be lower than that of the epoxy.

A coated substrate having a coating and a method of forming the same is disclosed, wherein the coating includes a plurality of discrete layers. The coating includes three reflective layers, an alloy layer disposed between two of the reflective layers, and two oxide layers and has a total thickness of 4000 Å or less.

This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10.sup.−6 (K.sup.−1) or less are bonded.

An optical fiber preform includes: a core formed of silica glass which does not contain Ge, wherein the core has at least one of characteristics in spectrometry of (1) an absorption peak is present at a wavelength of 240 nm to 255 nm, and (2) a wavelength at which an ultraviolet transmittance is 50% or lower is longer than 170 nm.

A method for producing a pane with an electrically conductive coating and a metallic strip soldered thereon is described. The method includes providing a substrate with an electrically conductive coating, providing a metallic strip with at least one through-hole, positioning the metallic strip on the electrically conductive coating, wherein the hole is arranged on the electrically conductive coating, and soldering the metallic strip to the electrically conductive coating via a soldering compound using an ultrasonic soldering tip.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Disclosed herein are embodiments of a curved glass article. The curved glass article includes a glass sheet having a first major surface and a second major surface. The second major surface is opposite to the first major surface, and the first major surface and the second major surface define a thickness therebetween. The curved glass article also includes a carrier having a curvature and being made of a carrier material. The carrier material has a coefficient of thermal expansion (CTE) of from 8(10.sup.−6)/° C. to 40(10.sup.−6)/° C. The glass sheet is adhered to the carrier such that the glass sheet conforms to the curvature of the carrier.

A structure according to an embodiment of the present disclosure includes: a first substrate; a second substrate opposed to the first substrate; a bonding layer provided between the first substrate and the second substrate; and a first decorative layer provided between the first substrate and the second substrate.

A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.