A glass lamination article includes a resin layer in contact with a base substrate such that a first interface is formed therebetween, and a glass substrate layer in contact with the resin layer such that a second interface is formed therebetween, wherein the resin layer may be an ultraviolet (UV)-curable resin layer. The glass lamination article has excellent impact resistance and strength, as well as excellent waviness.

The disclosure relates to a bond produced with an at least partially crystallized glass, such as a metal-to-glass bond, in particular a metal-to-glass bond in a feed-through element or connecting element, and to a method for producing such a bond, in particular in a feed-through element or connecting element. The at least partially crystallized glass includes at least one crystal phase and pores which are distributed in the at least partially crystallized glass in a structured manner.

Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

A composite panel suitable for heating an environment includes a face sheet having a 3D woven structure and abutting the environment, and a first core layer positioned on a side of the face sheet opposite the environment. The 3D woven structure includes at least one z-fiber extending in a first direction, the first direction representing a thickness of the face sheet. The woven structure further includes a plurality of weft layers, each having a weft fiber extending in a second direction, and a warp layer disposed between the plurality of weft layers, the warp layer having a warp fiber extending in a third direction. The z-fiber extends along the plurality of weft layers across a full extent of the 3d woven structure in the first direction.

An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.

An article includes at least one layer including a transparent portion and at least one metal portion; and a color-rendering layer; wherein the at least one metal portion is positioned in the article to provide reflection of incident light; and wherein the transparent portion is dimensioned to allow at least some incident light to pass through. A method of making an article is also disclosed.

There is provided a laminate that can suppress the warpage of a laminated product when used for the manufacture of the laminated product. This laminate includes a float glass substrate having a top surface and a bottom surface; and a metal layer provided on the top surface side of the float glass substrate.

A conductive structure having a self-assembled protective layer and a self-assembled coating composition are provided. The self-assembled coating composition includes a resin, a solvent, and a self-assembled additive. The self-assembled additive includes alkylamine, fluoroalkylamine, fluoroaniline, or a derivative thereof. The self-assembled additive has a concentration in a range of from about 0.01 mg/L to about 100 mg/L in the self-assembled coating composition. The conductive structure includes a substrate, a conductive layer, and the self-assembled protective layer. The conductive layer is disposed over the substrate. The self-assembled protective layer covers the conductive layer and has a resin, a solvent, and the above-mentioned self-assembled additive.

Laminated glass includes a pair of glass plates, an intermediate film positioned between the glass plates, an electrically conductive heating material positioned between the glass plates and having a surface in contact with the intermediate film, a first bus bar and a second bus bar connected to the electrically conductive heating material and positioned between the glass plates, disposed such that the electrically conductive heating material is interposed therebetween in a plan view, third bus bars positioned between the glass plates, and connecting the first and second bus bars to a pair of electrode leads, and a fourth bus bar at least partly positioned between the glass plates, and superposed on a part of at least one of the first to third bus bars, wherein the electrically conductive heating material, the first to the third bus bars are integrally formed of a same material.

Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.