Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

A sound interlayer includes a first layer made from a first material and a second layer, wherein the second layer comprises a damping system including at least one patch made from a second material different from the first material.

Embodiments described include adhesive bus bars for electrochromic or other optical state changing devices. The bus bars are configured to color match and/or provide minimal optical contrast with their surrounding environment in the optical device, provide better adhesion than ink based bus bars, as well as obviate the need to mitigate defects in underlaying layers.

A roof assembly, having: a roof deck; an insulation board assembly mounted onto the roof deck; and a roofing membrane adhered onto the insulation board assembly, wherein the insulation board assembly comprises: a foam insulation board, a woven top facer on a top side of the foam insulation board, and a woven bottom facer on a bottom side of the foam insulation board.

An insulation material having three or more layers, the layers including a metallic facing; and one or more nonwoven layers. One or more of the layers may be a needle punched layer. Each nonwoven layer may have a temperature resistance of about 400° C. or greater. The insulation material may be used for surrounding and insulating a battery, such as a battery for an electric vehicle.

Embodiments described include adhesive bus bars for electrochromic or other optical state changing devices. The bus bars are configured to color match and/or provide minimal optical contrast with their surrounding environment in the optical device, provide better adhesion than ink based bus bars, as well as obviate the need to mitigate defects in underlaying layers.

A process for debundling a carbon fiber tow into dispersed chopped carbon fibers suitable for usage in molding composition formulations is provided. A carbon fiber tow is fed into a die having fluid flow openings, through which a fluid impinges upon the side of the tow to expand the tow cross sectional area. The expanded cross sectional area tow extends from the die into the path of a conventional fiber chopping apparatus to form chopped carbon fibers, or through contacting tines of a mechanical debundler. Through adjustment of the relative position of fluid flow openings relative to a die bore through which fiber tow passes, the nature of the fluid impinging on the tow, the shape of the bore, in combinations thereof, an improved chopped carbon fiber dispersion is achieved. The chopped carbon fiber obtained is then available to be dispersed in molding composition formulations prior to formulation cure.

An apparatus is disclosed. The apparatus includes a resistive wire having a circumference. The apparatus further includes a first fiberglass layer disposed about the circumference of the resistive wire and along a length of the resistive wire. The apparatus further includes a second fiberglass layer. The apparatus further includes a third fiberglass layer, the second fiberglass layer disposed between the first fiberglass layer and the third fiberglass layer, the third fiberglass layer forming an outer layer and surrounding the second fiberglass layer.

Protective cover layers for electronic devices are described. In an embodiment, an electronic device includes a display panel and a protective cover layer over the display panel. The protective cover layer includes a transparent support substrate and a hardcoat layer covering an exterior facing surface of the transparent support substrate. The display panel may be a flexible display panel and the protective cover layer may flex with the flexible display panel.

Various embodiments described herein disclose a protective cover of an electronic device, a protective cover package including the protective cover, and an electronic device to which the protective cover is applied. The protective cover includes a first protective layer including a flat region and a curved region and having a specified transparency, the curved region being disposed at an edge of the flat region and having a specified curvature, a second protective layer disposed below the first protective layer, the second protective layer being thicker than the first protective layer by a specified thickness or more, a bonding layer for bonding the first protective layer and the second protective layer, and an adhesive layer disposed below the second protective layer, wherein the first protective layer is thicker than the second protective layer. Various embodiments are possible.