Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

An apparatus is disclosed. The apparatus includes a resistive wire having a circumference. The apparatus further includes a first fiberglass layer disposed about the circumference of the resistive wire and along a length of the resistive wire. The apparatus further includes a second fiberglass layer. The apparatus further includes a third fiberglass layer, the second fiberglass layer disposed between the first fiberglass layer and the third fiberglass layer, the third fiberglass layer forming an outer layer and surrounding the second fiberglass layer.

A floor, wall or ceiling panel comprises a core and a decorative top layer provided on the core. The core comprises a magnesium oxide-based board material, and wherein the aforementioned panel, on at least two opposite edges, is provided with coupling means allowing that two of such panels can be interlocked at the respective edges.

An insulation board assembly, having: a foam insulation board; a top facer attached onto a top side of the foam insulation board, the top facer being made of woven material; and a bottom facer attached onto a bottom side of the foam insulation board, the bottom facer being made of woven material. The top and bottom woven facers may have upper and lower coatings and non-woven layers on either side and woven and non-woven layers may be held together with a tie layer.

A sheet manufacturing apparatus according to the invention has a mixing unit that mixes fiber and resin powder in air; and a sheet forming unit that forms a sheet by laying and heating the mixture mixed by the mixing unit; the grindability index of the resin contained in the resin powder being 0.8 or less.

Protective cover layers for electronic devices are described. In an embodiment, an electronic device includes a display panel and a protective cover layer over the display panel. The protective cover layer includes a transparent support substrate and a hardcoat layer covering an exterior facing surface of the transparent support substrate. The display panel may be a flexible display panel and the protective cover layer may flex with the flexible display panel.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

An insulation board assembly, having: a foam insulation board; a top facer attached onto a top side of the foam insulation board, the top facer being made of woven material; and a bottom facer attached onto a bottom side of the foam insulation board, the bottom facer being made of woven material. The top and bottom woven facers may have upper and lower coatings and non-woven layers on either side and woven and non-woven layers may be held together with a tie layer.

A floor, wall or ceiling panel comprises a core and a decorative top layer provided on the core. The core comprises a magnesium oxide-based board material, and wherein the aforementioned panel, on at least two opposite edges, is provided with coupling means allowing that two of such panels can be interlocked at the respective edges.

External thermal insulation composite systems described herein include a concrete or masonry wall and a multilayer thermal insulation board on the concrete or masonry wall. The multilayer thermal insulation board includes a high density polyurethane layer having a first density from 100 kg/m.sup.3 to 2000 kg/mm.sup.3 according to ASTM D 1622 and a rigid polyurethane foam having a second density of less than 100 kg/m.sup.3 according to ASTM D 1622.