An enclosure component having a thickness for a building structure having an interior sheathing layer comprising paper; a first structural layer bonded to the interior sheathing layer and comprising a first generally rectangular structural panel of magnesium oxide arranged in a side-by-side relationship with a second generally rectangular structural panel of magnesium oxide to define a first structural panel seam between the first and second structural panels. There is a first binding strip of magnesium oxide positioned over the first structural panel seam and fastened to form a lap joint with the first structural panel and with the second structural panel, so as to bond together the first and second structural panes. The enclosure component includes a first strengthening layer, comprising woven fiber mat, bonded to the first structural layer; and a foam layer with first and second opposing faces comprising a first generally rectangular foam panel and a second generally rectangular foam panel arranged in a side-by-side relationship to define a foam panel seam between the first and second foam panels. The first structural panel seam is offset from the foam panel seam a select distance in a direction generally perpendicular to the thickness. The first strengthening layer is bonded to the first opposing face of the foam layer. The enclosure component also has a second structural layer comprising a third generally rectangular structural panel of magnesium oxide arranged in a side-by-side relationship with a fourth generally rectangular structural panel of magnesium oxide to define a second structural panel seam between the third and fourth structural panels. There is a second binding strip of magnesium oxide positioned over the second structural panel seam and fastened to form a lap joint with the third structural panel and with the fourth structural panel, so as to bond together the third and fourth structural panels. The second structural panel seam is offset from the foam panel seam a select distance in a direction generally perpendicular to the thickness; and the second structural layer is bonded to the second opposing face of the foam layer.

A thermal insulation component according to various aspects of the present disclosure includes a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix includes a thermal insulation material having a thermal conductivity of less than or equal to about 5 W/mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor includes at least one of an acrylate functional group or a methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor. In certain aspects, the present disclosure also provides an electronics assembly including an electronic component and a thermal insulation material in thermal communication with the electronic component. In certain aspects, the present disclosure also provides methods of manufacturing the thermal insulation component.

A strain gage comprises: a flat metallic element; a first layer, wherein the flat metallic element is laminated onto a first surface of the first layer and the flat metallic element covers a first part of the first surface of the first layer; and a second layer laminated onto a second surface of the first layer, wherein the second surface is opposite to the first surface, and a coefficient of thermal expansion (CTE) of the second layer is greater than a threshold value.

A thermosetting composition including at least a thermosetting compound, the thermosetting composition satisfying relationships represented by formulas (i) and (ii) below:

0.80≤b/a≤0.98  (i), and

0.05≤c/a≤0.30  (ii), wherein a, b, and c represent storage moduli (unit: GPa) at 30° C., 100° C., and 260° C., respectively, of a cured product formed by curing a prepreg obtained by impregnating or coating a base material with the thermosetting composition.

A prepreg, a laminated board, and a printed circuit board thereof are provided. The prepreg includes a halogen-free epoxy resin composition and a partially cured non-woven reinforcing material impregnated therein. The non-woven reinforcing material has a dielectric strength of 1.5 to 4.8 and a loss factor that is less than 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes: (a) 100 parts by weight of a halogen-free naphthalene type epoxy resin, (b) 10 to 25 parts by weight of a DOPO modifying curing agent, (c) 25 to 45 parts by weight of a cyanate resin, (d) 35 to 60 parts by weight of bismaleimide, (e) 45 to 65 parts by weight of a non-DOPO flame retardant, and (f) 0.5 to 15 parts by weight of a curing accelerator.

A conductive structure having a self-assembled protective layer and a self-assembled coating composition are provided. The self-assembled coating composition includes a resin, a solvent, and a self-assembled additive. The self-assembled additive includes alkylamine, fluoroalkylamine, fluoroaniline, or a derivative thereof. The self-assembled additive has a concentration in a range of from about 0.01 mg/L to about 100 mg/L in the self-assembled coating composition. The conductive structure includes a substrate, a conductive layer, and the self-assembled protective layer. The conductive layer is disposed over the substrate. The self-assembled protective layer covers the conductive layer and has a resin, a solvent, and the above-mentioned self-assembled additive.

The present invention relates to a method of producing a coherent growth substrate product formed of man-made vitreous fibres (MMVF), comprising the steps of (vi) providing MMVF; (vii) providing an uncured binder composition; (viii) providing a superabsorbent polymer; (ix) forming a mixture of the MMVF, the uncured binder composition and the superabsorbent polymer; (x) curing the uncured binder composition in the mixture to form the coherent growth substrate product; wherein the uncured binder composition comprises at least one hydrocolloid.

A method for manufacturing a semifinished product or part is disclosed in which a metal support embodied as a metal sheet or blank is covered with at least one prepreg containing a thermally cross-linkable thermosetting matrix with endless fibers, the thermosetting matrix of the prepreg is pre-cross-linked by means of heating, and the metal support covered with the pre-cross-linked prepreg is formed into a semifinished product or part by means of deep drawing or stretch deep drawing. In order to enable plastic deformation in fiber-reinforced regions of the metal support, it is proposed that during the pre-cross-linking of the thermosetting matrix of the prepreg, its matrix is transferred into a viscosity state that is higher than its minimum viscosity and prior to reaching its gel point, the prepreg is formed together with the metal support.

Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

There are provided a soundproof structure, which can have high soundproofing performance in a wide frequency band and in which visual recognition of through-hole can be suppressed, and a sound absorbing panel and a sound adjusting panel using the soundproof structure. A sheet member having a plurality of through-holes passing therethrough in a thickness direction and a sound absorbing body disposed in contact with one main surface of the sheet member are provided. An average opening diameter of the through-holes is 0.1 μm or more and less than 100 μm. Assuming that the average opening diameter of the through-holes is ϕ (μm) and an average opening ratio is σ a parameter A expressed by A=σ×ϕ.sup.2 is 92 or less.