B32B23/042

Cell packaging material and cell

A cell packaging material in which the substrate layer surface has excellent ink printing characteristics. Cell packaging material including a layered article provided with at least a substrate layer, a metal layer, and a heast-fusible layer in the stated order, the substrate layer being formed from a polyamide resin containing an ethylene-bis-stearic acid amide and an ethylene-bis-oleic acid amide.

MULTILAYER CONSTRUCTS FOR METABOLITE STRIPS PROVIDING INERT SURFACE AND MECHANICAL ADVANTAGE

The present disclosure relates to multilayer constructs for producing metabolite strips. The multilayer constructs include a substrate layer having a top surface and a bottom surface, a thin film metal conductor layer formed on the top surface of the substrate layer and configured to act as an electrode, and a Transparent Conductive Oxide (TCO) protective layer deposited on top of the metal conductor layer. The metabolic strips can be used, along with various measuring devices, for determining the presence of certain analytes in a specimen and for various like applications.

SYSTEMS, DEVICES, AND METHODS FOR MANUFACTURE AND USE OF LAMINATED SHEET METALS
20190224937 · 2019-07-25 ·

Various laminated compositions comprising sheet metal, methods of manufacture, and use thereof are disclosed.

Packaging material for batteries, method for producing same, and battery
10347876 · 2019-07-09 · ·

A packaging material for batteries, which is not susceptible to the formation of a pinhole or cracking during the forming, while having excellent formability, and is effectively suppressed in curling after the forming, which is formed of a laminate with at least a base layer, an adhesive layer, a metal layer and a thermally fusible resin layer in this order, and wherein: the tensile modulus of elasticity of the base layer in one direction and the tensile modulus of elasticity of the base layer in a perpendicular direction in the same plane are both within the range of from 400 N/15 mm to 1,000 N/15 mm (inclusive); and the absolute value of the difference between the tensile modulus of elasticity of the base layer in the one direction and the tensile modulus of elasticity of the base layer in the other is 150 N/15 mm or less.

Semiconductor wafer surface protection film and method for manufacturing semiconductor device

This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value Gbmin of the storage elastic modulus Gb in the range of 25 C. to less than 250 C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus Gb250 at 250 C. of 0.005 MPa or above, and a temperature at which Gbmin is exhibited of 50-150 C. The adhesive surface layer C has a minimum value Gcmin of the storage elastic modulus Gc in the range of 25 C. to less than 250 C. of 0.03 MPa.

GLASS LAMINATES WITH IMPROVED FLATNESS AND METHODS FOR FORMING THE SAME
20190184683 · 2019-06-20 ·

A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23 C. and 90% relative humidity for 7 days can be at most about 3 mm/m.

Collapsible insulating container liner
10322843 · 2019-06-18 · ·

Collapsible insulating container liners and methods of manufacturing the same are disclosed herein. The container liner is formed as one unitary, foldable body that includes, in one example, beveled edges that form top panel(s), bottom panel(s), and side panel(s) that facilitate folding of the body to form the resulting liner.

SOLVENT-BASED GRAVURE PRINTING INK FOR LAMINATION, PRINTED MATERIAL AND LAMINATE

A solvent-type gravure ink for a laminate according to the present invention contains a pigment, a binder resin, an organic solvent, and water. The solvent-type gravure ink contains 80 to 100 mass % in total of a polyurethane resin and a vinyl chloride copolymer resin in 100 mass % of the binder resin, and the mass ratio of polyurethane resin to vinyl chloride copolymer resin is 95:5 to 40:60. The solvent-type gravure ink contains 1 to 50 mass % of a structural unit derived from a polyether in 100 mass % of the polyurethane resin. The solvent-type gravure ink contains 0.1 to 15 mass % of a glycol ether-based organic solvent serving as the organic solvent and 0.1 to 5 mass % of the water in 100 mass % of the gravure ink.

MEMBRANE FOR STICKING TO LIVING ORGANISM, AND METHOD FOR PRODUCING SAME

A cellulose membrane according to an embodiment of the present disclosure is a self-supporting cellulose membrane having a thickness of between 20 nm and 1300 nm, inclusive, composed of regenerated cellulose having a weight average molecular weight of 150,000 or more.

Two-component solvent-less adhesive composition

The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component containing the reaction product of (i) an isocyanate monomer and (ii) a first dimer acid polyester polyol; and (B) a polyol component containing (i) a second dimer acid polyester polyol and (ii) optionally, a polyol selected from a polyether polyol, a polyester polyol, and combinations thereof. The two-component solvent-less adhesive composition contains from 15 wt % to 45 wt % units derived from dimer acid, based on the total weight of the two-component solvent-less adhesive composition.