Patent classifications
B32B27/24
Composite structure
A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.
Composite structure
A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.
MANUFACTURING METHOD OF SHEET-LIKE CONDUCTIVE MEMBER, AND SHEET-LIKE CONDUCTIVE MEMBER
A manufacturing method of a sheet-shaped conductive member includes: providing a pseudo sheet structure to a first film, the pseudo sheet structure including a plurality of conductive linear bodies arranged at an interval therebetween, the first film including a process film and a first resin layer; attaching a second film including a second resin layer to the first film with the second resin layer in contact with the pseudo sheet structure; and drying or curing at least one of the first resin layer or the second resin layer.
MANUFACTURING METHOD OF SHEET-LIKE CONDUCTIVE MEMBER, AND SHEET-LIKE CONDUCTIVE MEMBER
A manufacturing method of a sheet-shaped conductive member includes: providing a pseudo sheet structure to a first film, the pseudo sheet structure including a plurality of conductive linear bodies arranged at an interval therebetween, the first film including a process film and a first resin layer; attaching a second film including a second resin layer to the first film with the second resin layer in contact with the pseudo sheet structure; and drying or curing at least one of the first resin layer or the second resin layer.
Use of a vinylidene fluoride copolymer for providing a film with properties of adhesion
The present invention relates to the use of a fluorinated copolymer in the manufacture of a solid polymer film, to give said film properties of adhesion to a metal surface or to glass. It also relates to a process for improving the adhesion of a fluoropolymer to a metal, polymer or glassy substrate, and also to a composite part comprising a solid polymer film in direct contact with at least one metal or glassy element.
Use of a vinylidene fluoride copolymer for providing a film with properties of adhesion
The present invention relates to the use of a fluorinated copolymer in the manufacture of a solid polymer film, to give said film properties of adhesion to a metal surface or to glass. It also relates to a process for improving the adhesion of a fluoropolymer to a metal, polymer or glassy substrate, and also to a composite part comprising a solid polymer film in direct contact with at least one metal or glassy element.
Resin composition, molded article, laminate, gas barrier material, coating material and adhesive
A resin composition is provided that contains a urethane resin and a smectite with partially immobilized lithium.
Resin composition, molded article, laminate, gas barrier material, coating material and adhesive
A resin composition is provided that contains a urethane resin and a smectite with partially immobilized lithium.
Endless belt, image-forming apparatus, endless belt unit, and polyimide resin molded product
An endless belt includes a polyimide resin layer containing a polyimide resin containing two or more components derived from tetracarboxylic dianhydrides and/or two or more components derived from diamine compounds; and at least one solvent selected from a solvent group A consisting of urea-based solvents, alkoxy-group-containing amide-based solvents, and ester-group-containing amide-based solvents in an amount of from about 50 ppm to about 2,000 ppm.
Endless belt, image-forming apparatus, endless belt unit, and polyimide resin molded product
An endless belt includes a polyimide resin layer containing a polyimide resin containing two or more components derived from tetracarboxylic dianhydrides and/or two or more components derived from diamine compounds; and at least one solvent selected from a solvent group A consisting of urea-based solvents, alkoxy-group-containing amide-based solvents, and ester-group-containing amide-based solvents in an amount of from about 50 ppm to about 2,000 ppm.