There is provided a metal-organic composite which exhibits synergistic improvement in thermo-mechanical properties when compared with either of the components alone. The composites of this invention can be readily fabricated into various shapes by conventional molding processes including injection or compression molding. As a result, the composites of this invention find a variety of applications in fabricating a variety of three dimensional articles including automotive parts among others.

The thermally conductive laminate of an embodiment of the present disclosure includes a thermally conductive resin layer containing a thermally conductive raw material and a resin and having first and second major faces, and a porous base material provided on at least one of the first and second major faces of the thermally conductive resin layer, the porous base material being arranged in a proportion of approximately 75% or less relative to a total area of the major faces of the thermally conductive resin layer to which the base material was arranged.

A multilayer curable resin film comprising a first resin layer comprising a first curable resin composition including a polyphenylene ether oligomer (A1) with an end modified by an aromatic vinyl group and a curing agent (A2) and a second resin layer comprising a second curable resin composition including an alicyclic olefin polymer (B1) and a curing agent (B2), a prepreg comprised of this including a fiber substrate, and a laminate, cured product, composite, and multilayer circuit board obtained using these are provided.

A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×10.sup.4 or more and less than 45×10.sup.4. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.

A matrix material dispersed with one or more susceptor structures can be formed into a feedstock for an additive manufacturing process. The one or more susceptor structures can be excited by an energy field such as an electric field, a magnetic field, an electromagnetic field, or any combination thereof, to produce heat. The heat that is produced can be transferred to the matrix material that surrounds the one or more susceptor structures to provide heat treatment to the matrix material. The heat treatment can improve the material and mechanical properties of three dimensional objects formed from the feedstock.

A matrix material dispersed with one or more susceptor structures can be formed into a feedstock for an additive manufacturing process. The one or more susceptor structures can be excited by an energy field such as an electric field, a magnetic field, an electromagnetic field, or any combination thereof, to produce heat. The heat that is produced can be transferred to the matrix material that surrounds the one or more susceptor structures to provide heat treatment to the matrix material. The heat treatment can improve the material and mechanical properties of three dimensional objects formed from the feedstock.

Provided is a laminate having, on a substrate, a gel layer which is excellent in heat resistance, has low elastic modulus, low stress and is excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Also provided is a method for manufacturing an electronic component in which use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component. The laminate includes a curing reactive silicone gel layer on at least one type of substrate.

Provided is a laminate having, on a substrate, a gel layer which is excellent in heat resistance, has low elastic modulus, low stress and is excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Also provided is a method for manufacturing an electronic component in which use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component. The laminate includes a curing reactive silicone gel layer on at least one type of substrate.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.