B32B27/26

Adhesive sheet

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
11472957 · 2022-10-18 · ·

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1)(CH.sub.2OR.sup.2)(CH.sub.2OR.sup.3)(CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
11472957 · 2022-10-18 · ·

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1)(CH.sub.2OR.sup.2)(CH.sub.2OR.sup.3)(CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

Photocurable composition for making layers with high etch resistance
11597781 · 2023-03-07 · ·

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one acrylate monomer including at least one cyano group (CN-acrylate monomer). The presence of a low amount of the CN-acrylate monomer between 10 wt % and not greater than 30 wt % can lower the contact angle of the composition and may improve the etch resistance of a photo-cured layer made from the photocurable composition.

Photocurable composition for making layers with high etch resistance
11597781 · 2023-03-07 · ·

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one acrylate monomer including at least one cyano group (CN-acrylate monomer). The presence of a low amount of the CN-acrylate monomer between 10 wt % and not greater than 30 wt % can lower the contact angle of the composition and may improve the etch resistance of a photo-cured layer made from the photocurable composition.

MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME
20220324213 · 2022-10-13 ·

The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.

MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME
20220324213 · 2022-10-13 ·

The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.

Method of making coextruded, cross-linked polyolefin foam with TPU cap layers

The present disclosure is directed to a physically crosslinked, closed cell continuous multilayer foam structure comprising at least one foam polypropylene/polyethylene layer with a TPU cap layer. The multilayer foam structure can be obtained by coextruding a multilayer structure comprising at least one foam composition layer with at least one cap composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

Method of making coextruded, cross-linked polyolefin foam with TPU cap layers

The present disclosure is directed to a physically crosslinked, closed cell continuous multilayer foam structure comprising at least one foam polypropylene/polyethylene layer with a TPU cap layer. The multilayer foam structure can be obtained by coextruding a multilayer structure comprising at least one foam composition layer with at least one cap composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

Multifunctional surfacing material with burn-through resistance

A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.