A display panel manufacturing method is provided. A display function unit is provided on a surface of a first substrate. Sealing material is provided in a region on the surface of the first substrate that is surrounding the display function unit. Resin is then placed in an inside region of the sealing material over the surface of the first substrate. A total volume amount of the resin placed is greater than a volume capacity of an open space surrounded by the sealing material above the surface of the first substrate. A second substrate is bonded with the first substrate via the sealing material to provide a closed space with the resin being provided in the closed space.

Matte substrates comprising a water based coating composition and a base substrate. The water based coating composition comprises either no or only small amounts of mineral filler, refractory filler and/or organic filler and no other matting agents. The water based coating composition is typically applied to the base substrate at a coating weight of less than or equal to about 3 dry pounds of the water based coating composition per about 3,000 square feet of the base substrate. The matte substrate generally has a 60 gloss less than about 20.

A sheet processing apparatus sandwiches a sheet media in a two-ply sheet in which two sheets are overlaid and bonded together at a portion of the two-ply sheet. The sheet processing apparatus includes a fixing device, a tray, and a roller. The fixing device applies heat and pressure to the two-ply sheet. The tray is disposed downstream from the fixing device in a conveyance direction of the two-ply sheet, to stack the two-ply sheet. The roller conveys the two-ply sheet vertically downward toward the tray after the two-ply sheet passes through the fixing device.

A panel including at least a substrate of thermoplastic material and a top layer with a printed decor and a translucent or transparent wear layer. The substrate has a thickness larger than one half of the thickness of the entire panel, and the substrate at least includes two layers, where the two layers each include thermoplastic material. A first one of the two layers further includes at least 60 percent by weight of filler materials and a second one of the two layers includes less fillers or is not filled, and is situated above the first one of the two layers.

A panel including at least a substrate of thermoplastic material and a top layer with a printed decor and a translucent or transparent wear layer. The substrate has a thickness larger than one half of the thickness of the entire panel, and the substrate at least includes two layers, where the two layers each include thermoplastic material. A first one of the two layers further includes at least 60 percent by weight of filler materials and a second one of the two layers includes less fillers or is not filled, and is situated above the first one of the two layers.

Processes are disclosed for separating a first layer from a remainder of a tapered multilayer interlayer sheet, in which the tapered multilayer interlayer sheet is heated, and thereafter the first layer is separated from the remainder of the tapered multilayer interlayer sheet by pulling the first layer and the remainder of the tapered multilayer interlayer sheet in different directions, in a defined orientation, without the tapered multilayer interlayer sheet wrinkling or tearing.

A method for fabricating a metallized assembly for a microcircuit card exhibiting a metallized effect, the assembly forming an internal layer of the card. The method comprises providing a support layer formed of a plastic material sensitive to heat exhibiting a first shrinkage ratio, the support layer having, on a surface, at least the dimensions of a microcircuit card, providing a metallized film held on a first non-adhesive bearing liner, the first non-adhesive bearing liner exhibiting a shrinkage ratio less than that of the support layer, transferring the metallized film onto the support layer by applying heat and pressure, and removing the first non-adhesive bearing liner. Also provided are a method for fabricating a microcircuit card and a microcircuit card obtained by this method.