A film coating apparatus and a film coating method for improving the adhesion of a thin film and a substrate are provided. The substrate fixing device has an arched surface for fixing the substrate. The thin film bearing device has a bearing surface opposite to the arched surface and being detachably disposed to the bearing surface. The press roll is located at a side of the thin film away from the substrate fixing device, and may move towards the substrate and roll from one end of the thin film to the other end.

A system for manufacturing a laminated film, in which a first film and a second film are sequentially laminated, and the system includes: a film supplying part which supplies the first film and the second film; a bonding part which includes a first roll and a second roll that rotate in opposite directions, and compresses the first film and the second film supplied from the film supplying part and bonds the first film and the second film as the laminated film; and a bending inducing part which supports and bends the laminated film bonded and output from the bonding part, in which the second roll shifts in a direction along a circumference of a virtual circle having a larger radius than a radius of the first roll to control the bending of the laminated film.

A novel engineered wood product and method of making same that withstands the stresses, both natural and man-made, that cause warp, twist and bow.

A panel including at least a substrate of thermoplastic material and a top layer with a printed decor and a translucent or transparent wear layer. The substrate has a thickness larger than one half of the thickness of the entire panel, and the substrate at least includes two layers, where the two layers each include thermoplastic material. A first one of the two layers further includes at least 60 percent by weight of filler materials and a second one of the two layers includes less fillers or is not filled, and is situated above the first one of the two layers.

The method for producing a microcircuit card including a film having a very low level of shrinkage between two overlay layers, carrying at least one electronic component and an assembly of layers in which a cavity is formed containing the film and the electronic component, involves: forming the assembly to include a central layer 16 made from a material having a very low level of shrinkage between two layers of a plastic material having a substantially higher level of shrinkage, for example PVC, forming, through the assembly, a cavity of which the surface area advantageously equals between 30% and 90% of the surface area of the outer faces of the microcircuit card that is to be produced, embedding the film and the electronic component in a resin so as to occupy the space in the cavity and laminating the two overlay layers.

Provided is a film including a matrix layer formed with polyimide for a matrix obtained from pyromellitic dianhydride and m-tolidine, a first adhesive layer formed on one surface of the matrix layer and formed with first thermoplastic polyimide, and a second adhesive layer formed on the other surface of the matrix layer and formed with second thermoplastic polyimide, wherein maximum height roughness of a first interface between the matrix layer and the first adhesive layer and maximum height roughness of a second interface between the matrix layer and the second adhesive layer are 1.0 μm or less.

An air-floating thin film bonding apparatus and its air-floating roller is provided. The apparatus is composed of an air-floating rollers, which can blow out airflow at a specific angle to be applied to the base film with three-dimensional obstacles. The positive pressure provided by the airflow can be utilized to fill the gap space caused by the three-dimensional obstacles. Therefore, the base film can bond to the bonding film tightly to overcome the wrinkles and defects caused by the three-dimensional obstacle and the problem of unflatness of the film-bonding can be solved.

An air-floating thin film bonding apparatus and its air-floating roller is provided. The apparatus is composed of an air-floating rollers, which can blow out airflow at a specific angle to be applied to the base film with three-dimensional obstacles. The positive pressure provided by the airflow can be utilized to fill the gap space caused by the three-dimensional obstacles. Therefore, the base film can bond to the bonding film tightly to overcome the wrinkles and defects caused by the three-dimensional obstacle and the problem of unflatness of the film-bonding can be solved.

A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.

This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.