Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

The invention relates to a method for forming a monocell or a bi-cell for a lithium-ion electric energy accumulating device, wherein it is provided to first laminate, in a first laminating unit, a first arrangement comprising a first electrode and two separating elements, so as to obtain a multilayered laminated element. In the first arrangement, the electrode is interposed between the two separating elements without yet being laminated to either of the two separating elements. The method then provides to form a second arrangement comprising the multilayered laminated element and a second electrode. The method finally provides to laminate the second arrangement in a second laminating unit, so as to obtain the cell.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

At least one puck is used to manufacture a vacuum insulated panel with a shaped opening. A pair of barrier films are positioned about an insulated core having a shaped opening such as a through bore, cutout, or relief. The puck includes a protrusion having a shape similar to that of the opening of the insulated core. With the barrier films positioned about the insulated core, the pucks are inserted into the opening from opposite sides of the insulated core to thereby compress the barrier films between the shaped protrusions of the pucks to thereby prevent wrinkles and/or creases in the barrier films. The insulated core is then subjected to a vacuum to evacuate the insulated core of any gases and the barrier films are heat sealed to maintain the insulated core in the evacuated state. Excess barrier film is then removed to provide a wrinkle and/or crease free seal.

At least one puck is used to manufacture a vacuum insulated panel with a shaped opening. A pair of barrier films are positioned about an insulated core having a shaped opening such as a through bore, cutout, or relief. The puck includes a protrusion having a shape similar to that of the opening of the insulated core. With the barrier films positioned about the insulated core, the pucks are inserted into the opening from opposite sides of the insulated core to thereby compress the barrier films between the shaped protrusions of the pucks to thereby prevent wrinkles and/or creases in the barrier films. The insulated core is then subjected to a vacuum to evacuate the insulated core of any gases and the barrier films are heat sealed to maintain the insulated core in the evacuated state. Excess barrier film is then removed to provide a wrinkle and/or crease free seal.

A stitched fabric including a conductive core and a yarn stitched through and forming stitch holes in the conductive core, where the yarn extends over at least a majority of a width and a length of the fabric. The yarn and the conductive core may be free from contact by another layer on either side of the conductive core. In some circumstances, a barrier layer is disposed over at least one side of the conductive core and a melted portion of the barrier layer fills a portion of the stitch holes.

A method of stencil printing includes printing a layer of non-sag adhesive onto a first substrate, adding topography to the layer of non-sag adhesive, and contacting the layer of non-sag adhesive with a second substrate. The second substrate initially contacts only about 5% or less of exposed surface area of the layer of non-sag adhesive.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.