The present invention relates to a process for laminating components with sheets, in which an adhesive is applied to the surface of the laminating sheet and/or of the component in a grid-like manner, so that, after the sheet and the component are joined, the adhesive is arranged between the sheet and the component, and the regions between the applied adhesive form a channel system that enables the removal of the air that is present between the component and the sheet. The invention further relates to a laminated molded part obtainable by the above-outlined process. The use of an adhesive grid provided between a component and a laminating sheet results in a reduction or prevention of air inclusions when the component is laminated with a laminating sheet.

A tool for forming a panel including a core area, at which plies sandwich a core, and a trim area surrounding the core, at which the plies are bonded together, is provided and includes a body having a surface on which the panel is formable, an assembly to apply bonding pressure to the plies at least at the core and trim areas and a clamping device external to the assembly to apply a clamping force to the vacuum bag and the plies.

Devices, methods, and systems for two-phase thermal management are provided in accordance with various embodiments. For example, a two-phase thermal management device is provided that may include two or more containment layers and/or one or more porous layers positioned between at least a portion of each of the two or more containment layers. The portion of each of the two or more containment layers and the one or more porous layers may be bonded with each other. The two or more containment layers and one or more porous layers may be bonded with each other to form an uninterrupted stack of material layers utilizing diffusion bonding. Some embodiments include a method of forming a two-phase thermal management device including arranging multiple materials layers including one or more porous layers positioned with respect to one or more containment layers; and/or bonding the multiple material layers with each other.

Disclosed are a vacuum press method and apparatus. The vacuum press apparatus includes an upper pressing part provided with an upper diaphragm, a lower pressing part provided with a lower diaphragm, an airtightness-maintaining member mounted between the upper pressing part and the lower pressing part, a processing space formed by the upper and lower pressing parts, the airtightness-maintaining member, and the upper and lower diaphragms, a vacuum-pressing operation part communicating with the processing space, a heating part mounted in the upper pressing part, an ascending/descending heating operation space formed between the upper diaphragm and the heating part, an upper ascending/descending operation part communicating with the ascending/descending heating operation space, a cooling part mounted in the lower pressing part, an ascending/descending cooling operation space formed between the lower diaphragm and the cooling part, and a lower ascending/descending operation part communicating with the ascending/descending cooling operation space.

A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, a showerhead module through which process gas from the process gas source is supplied to the processing zone of the vacuum chamber, and a substrate pedestal module. The substrate pedestal module includes a platen made of ceramic material having an upper surface configured to support a semiconductor substrate thereon during processing, a stem made of ceramic material having an upper stem flange that supports the platen, and a backside gas tube made of ceramic material that is located in an interior of the stem. The backside gas tube includes an upper gas tube flange that is located between a lower surface of the platen and an upper surface of the upper stem flange wherein the backside gas tube is in fluid communication with at least one backside gas passage of the platen and the backside gas tube is configured to supply a backside gas to a region below a lower surface of a semiconductor substrate that is to be supported on the upper surface of the platen during processing.

A heat ray shielding film is disclosed, including composite tungsten oxide particles; and an ionomer resin. The composite tungsten oxide particles are expressed by a general formula M.sub.xWO.sub.y (where M denotes one or more kinds of elements selected from Cs, Rb, K, Tl, In, Ba, Li, Ca, Sr, Fe, Sn, Al, Cu, and Na, and 0.1≦x≦0.5 and 2.2≦y≦3.0).

The present invention relates to a method for manufacturing a laminated object. A foam core and a skin are provided and the foam core and the skin are arranged relative to each other. The skin is heated. The skin is pierced by a vacuum application device. Further, vacuum is applied via the vacuum application device so as to withdraw a gaseous medium, in particular air, from within the foam core and from a space or spaces between the foam core and the skin, in order to draw the skin towards the foam core. Furthermore, the invention provides a manufacturing device for manufacturing a laminated object, laminated objects comprising a foam core and a skin, a method for producing pallets comprising a foam core and a skin, as well as pallets comprising a foam core and a skin.

At least one puck is used to manufacture a vacuum insulated panel with a shaped opening. A pair of barrier films are positioned about an insulated core having a shaped opening such as a through bore, cutout, or relief. The puck includes a protrusion having a shape similar to that of the opening of the insulated core. With the barrier films positioned about the insulated core, the pucks are inserted into the opening from opposite sides of the insulated core to thereby compress the barrier films between the shaped protrusions of the pucks to thereby prevent wrinkles and/or creases in the barrier films. The insulated core is then subjected to a vacuum to evacuate the insulated core of any gases and the barrier films are heat sealed to maintain the insulated core in the evacuated state. Excess barrier film is then removed to provide a wrinkle and/or crease free seal.

A carbon fiber toothed structure has a body. The body is circular and has a toothed segment and at least one carbon fiber cloth. The toothed segment is formed on an outer periphery of the body. The at least one carbon fiber cloth is deposited on a front side and a rear side of the body from a center to the outer periphery of the body to cover the toothed segment. The body is made by stacking multiple circular carbon fiber cloths of different diameters with each other. Some of the carbon fiber cloths deposited in the body have smaller diameters than those of the others of the carbon fiber cloths to enable the center of the body being thicker than the outer periphery of the body. The toothed segment has two guiding inclined planes respectively deposited on the front side and the rear side of the body.

The present invention relates to the use of a radiation-hardenable resin composition for producing solar laminates, a method for creating a solar laminate using the resin composition according to the invention, and a solar laminate that can be produced using this method.