A resin molded article is equipped with a resin base material layer, a cover layer, and a design layer. The design layer is provided on a design side end surface of the resin base material layer, whereas the cover layer is provided on a cover side end surface which is a rear surface of the design side end surface. Further, the cover layer includes a first end surface facing toward the cover side end surface, and a second end surface which is a rear surface of the first end surface. The first end surface is covered by a first coating layer, and the second end surface is covered by a second coating layer.

A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.

Provided is a lamination device for a photovoltaic module. The lamination device includes: a conveyor, a vacuum adsorption structure, a vacuum break structure and a lamination wheel. The vacuum adsorption structure is disposed on a first end of the conveyor, and configured to adsorb the photovoltaic module to the conveyor. The vacuum break structure is disposed on a second end of the conveyor, and configured to separate the photovoltaic module from the conveyor. The lamination wheel is disposed above the conveyor. A lamination gap is provided between the lamination wheel and the conveyor. A projection of the lamination wheel on the conveyor is between a projection of the vacuum adsorption structure on the conveyor and a projection of the vacuum break structure on the conveyor.

The present invention relates to a lamination process for producing a multilayer laminate, preferably to a lamination process for producing a photovoltaic (PV) module, and to a PV module laminate.

Equipment of making a substrate of plastic flooring contains: an extrusion unit, a thickness regulating unit, and a rolling apparatus. The extrusion unit includes an outlet, and the thickness regulating unit including an inlet, a channel, and a cooler. The rolling apparatus includes a first roller, a second roller, and a press roller. The press roller at least includes a contacting roller and a pressing roller, wherein the contacting roller is configured to roll a foaming sheet, a printing layer, and an abrasion resistant layer. Furthermore, a heating unit heats the foaming sheet, the printing layer, and the abrasion resistant layer so that the foaming sheet, the printing layer, and the abrasion resistant layer are connected by using the pressing roller.

A panel for cladding a ceiling or wall in a cabin, especially the cabin of a passenger aircraft, in which a board is laminated on both sides with a cover layer which is made of fibrous material or fabric, which is impregnated with resin or a thermoplastic material, and is cured under the effects of pressure and temperature, said board having at least one core with a honeycomb structure formed by a large number of walls, said walls being compressed or bent in a pre-defined region of the board by between 5% and 50%.

A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.

The present invention relates to a lamination process for producing a multilayer laminate, preferably to a lamination process for producing a photovoltaic (PV) module, and to a PV module laminate.

The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The crosslinked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.

Thermally laminated foam boards, methods for making thermally laminated foam boards, apparatus for making thermally laminated foam boards, smaller foam pieces made from thermally laminated foam boards, methods for making smaller foam pieces from thermally laminated foam boards, parts made from thermally laminated foam boards, methods for making parts from thermally laminated foam boards, and tools for making parts from thermally laminated foam boards are disclosed. The thermally laminated foam boards are made by thermally bonding at least two polystyrene boards together.