A method for producing a laminated embossed web includes the steps of: (a) providing a first web and at least a further web, (b) embossing the first web with a first pattern of embossments, each embossment comprising a top and a side, (c) providing an adhesive with an electrostatic charge, (d) directing the adhesive to the tops of the embossments, and (e) combining the webs.

A method for laminating glass panels includes (1) providing a TFT substrate and a CF substrate to be laminated, in which the CF substrate is coated with a seal resin and the TFT substrate carries liquid crystal dropped thereon; (2) aligning and laminating the TFT substrate and the CF substrate in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate for carrying out UV curing of the seal resin interposed between the CF substrate and the TFT substrate so as to complete a UV curing process; and (4) removing the laminated CF substrate and the TFT substrate that have been subjected to the UV curing process out of the vacuum environment.

A wafer bonding system and method using a combination of heat and a pneumatic force to bond two wafers held together in alignment. The wafers are heated via a non-contact, gaseous interface, thermal path between heating elements and the wafers. The pneumatic force is created by a pressure differential between a first pressure surrounding the two wafers and a second pressure, which is less than the first pressure, maintained between the two wafers.

A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

A method of manufacturing an electrode body includes a charging step, a first laminating step, and a second laminating step to manufacture the electrode body by laminating positive and negative electrode plates by interposing a separator therebetween. In the charging step, one of the positive and negative electrode plates is a first electrode plate and an other one is a second electrode plate, and one of the first electrode plate and the separator is charged to a potential enough to generate an attraction force between the first electrode plate and the separator. The first laminating step includes bringing the first electrode plate and the separator, at least one of which is charged, into direct contact to attach each other to form a laminated body. In the second charging step, the second electrode plate is laminated on the laminated body to form the electrode body.

The present invention provides a method for laminating glass panels and a vacuum lamination device using the method. The method includes (1) providing a TFT substrate (240) and a CF substrate (220) to be laminated, the CF substrate (220) being coated with a seal resin (204), the TFT substrate (240) carrying liquid crystal (402) dropped thereon; (2) aligning and laminating the TFT substrate (240) and the CF substrate (220) in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate (240) for carrying out UV curing of the seal resin (204) interposed between the CF substrate (220) and the TFT substrate (240) so as to complete a UV curing process; (4) removing the laminated CF substrate (220) and the TFT substrate (240) that have been subjected to the UV curing process out of the vacuum environment.

Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to have voids left at the interface between the adhesive layer and another surface material. An adhesive layer-equipped transparent surface material 1 comprises an adhesive layer 14 formed on at least one surface of a protective plate 10 (a transparent surface material), wherein the adhesive layer 14 has a layer portion 18 spreading over the surface of the protective plate 10 and a barrier portion 20 surrounding the periphery of the layer portion 18; and the layer portion 18 has a shear modulus at 35 C. of from 0.5 to 100 kPa.

An electrostatic chuck unit includes a first electrostatic chuck that includes a first plate that includes a surface that is concavely curved in a first direction and a first electrode pattern disposed on the surface of the first plate, and a second electrostatic chuck spaced apart from the first electrostatic chuck in a second direction opposite to the first direction and that includes a second plate that includes a surface adjacent to the first electrostatic chuck and that is convexly curved in the first direction and a second electrode pattern disposed on the surface of the second plate. Each of the first electrode pattern and the second electrode pattern includes an electrode, and a width of the electrode is between 10 mm and 30 mm.

The method for shaping a carrier sheet of high hardness, in particular a gres sheet, comprises the steps of providing a solid carrier sheet of high hardness having a thickness of at least 6 mm; covering (S100) a front surface of the carrier sheet with a removable vibration-absorbing protective layer; providing (S110) the surface of the protective layer remote from the carrier sheet with a glass sheet; on the back surface of the carrier sheet opposite the front surface thereof, forming a plurality of cavities according to a predetermined pattern. The step of forming comprises forming the cavities by milling (S120) so that in each cavity the remaining thickness of the carrier sheet along the front surface is at least 3 mm and at most 5 mm; during milling, at least one physical property of the vibration of the carrier sheet is continuously measured (S121) on the front surface of the carrier sheet by means of at least one sensor; on the basis of at the least one physical property measured by the sensor, adjusting the operation of the milling tool so that the vibration properties of the carrier sheet do not exceed predetermined threshold values; by applying a first optical method (S130), taking a first 3D image of the surface roughness of the milled cavities; further reducing the surface roughness of the cavities by shot blasting (S140), wherein during the shot blasting, the operation of the shot blasting tool is controlled using parameters determined on the basis of the first 3D image taken during the first scanning; by applying a second 3D scanning (S150), taking a second 3D image of the surface roughness of the cavities treated by shot blasting; and by applying laser beam milling (S160), further reducing the surface roughness of the cavities, wherein the operation of the laser beam milling tool is controlled on the basis of the second 3D image taken after the laser beam milling by the second 3D scanning so that the surface roughness of the cavities falls in the submicron range.