A method for producing a multilayer film including at least two layers joined by a two-component adhesive includes the following steps: spreading a first component A of a two-component adhesive on a first face of a first layer of film; spreading a second component B of the two-component adhesive on a first face of a second layer of film; bringing the first and second faces of the first and second layers into mutual contact joining the components and to form an adhesive and join the two layers in a multilayer film; and winding the multilayer film obtained.

The invention relates to a formaldehyde-free binder composition for mineral fibres comprising at least one phenol and/or quinone containing compound, and at least one protein.

The invention relates to a method of bonding together surfaces of two or more elements, whereby at least one of the two or more elements is a mineral wool element, said mineral wool element(s) being bound by a mineral wool binder, the method comprising the steps of providing two or more elements; applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other; curing the adhesive, wherein the adhesive comprises at least one protein; at least one phenol and/or quinone containing compound, and/or at least one enzyme.

Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Two-component solventless adhesive compositions for lamination applications and laminated structures, including flexible laminated packaging, comprising at least two substrates, including structures comprising reverse printed ink films and/or metalized films. The adhesive comprises a prepolymer having one or more oligomers with a relatively high molecular weight.

The invention provides protein adhesives containing certain additives and methods of making and using such adhesives. The protein adhesives contain ground plant meal or an isolated polypeptide composition obtained from plant biomass in combination with certain additives, such as an exfoliated clay or partially exfoliated clay.

A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same.

An electromagnetic wave shielding wallpaper is described. The wallpaper includes a conductive layer having a base material and a conductive material, and an adhesive layer. The wallpaper may include a protective layer disposed on a first side of the conductive layer, a fire retardant layer disposed on a second side of the conductive layer, and the adhesive layer disposed on the fire retardant layer.

An anisotropic conducting adhesive is improved in conductivity without increasing the density of admixed conductive particles by inducing metallic fusion between the surfaces of the conducting particles and the surfaces being bonded. The metallic fusion may be promoted by physical/chemical interaction characteristic of certain materials at a compressed interface; by compression sufficient to deform the conductive particles in a manner that increases the mechanical contact area; by heating (with or without melting of a material), which may also serve to cure the adhesive matrix; or by acoustic vibration, e.g., ultrasonic vibration. The resulting metallic-fusion joint is stronger, as well as more conductive, than a joint in which the particles and surfaces are held in unfused mechanical contact.

A process for manufacturing a base board of a high-speed rail equipment cabin using a composite material is disclosed. The composite material includes: aramid honeycomb, PET foam, 3K twill carbon fiber flame retardant prepreg, unidirectional carbon fiber flame retardant prepreg, glass fiber flame retardant prepreg, aramid flame retardant prepreg, and 300 g/cm.sup.2 single component medium temperature curing blue epoxy adhesive. The process includes manufacturing a base-board main plate (1), a base-board handle (2) and two base-board sliders (3). While installation, the base-board handle (2) is stuck to one side of the base-board main plate (1), and the two base-board sliders (3) are respectively stuck to another two opposite sides of the base-board main plate (1). The weight of the base board made from the composite material is 35%-40% lower than the base board made from the aluminum alloy material, which leads to a good prospect of application.