The invention relates to a method for producing a multilayer structure comprising an organic barrier layer, adhesive layer and substrate, comprising the following steps (a) providing a carrier film, (b) wherein a major part of the surface of the carrier film is provided with a release agent chosen from (i) an organic release layer, which organic release layer has the capacity to effect a releasable bond from the surface of the carrier film and a non-releasable bond with the surface of an organic barrier layer to be applied on the release layer and/or (ii) a metal layer on the carrier film which adheres stronger to the carrier film than to the organic barrier layer, (c) providing an organic barrier layer on the release agent, (d) providing an adhesive layer on the organic barrier layer, and bonding the organic barrier layer with said adhesive to a substrate, and (e) stripping said carrier film from the multilayer structure.

A packaging cushion includes a first liner and a second liner opposite one another and each defining an inner surface. A transverse liner axis extends normal to the inner surfaces. The packaging cushion includes a mesh bonded to and disposed between the first and second liners. The mesh has a top mesh surface and an opposed bottom mesh surface. The mesh defines a plurality of nodes and a plurality of legs interconnecting the plurality of nodes. Each of the plurality of nodes defines 1) a top node surface defined by the top mesh surface, 2) a bottom node surface defined by the bottom mesh surface, and 3) a transverse node axis extending substantially normal to the top and bottom node surfaces. The transverse node axes of at least some of the plurality of nodes are each oriented at an oblique angle relative to the transverse liner axis.

A method, apparatus, and product-by-process, for preparing an RFID access card constructed out of wood is disclosed. The method involved preparing two wooden surfaces of appropriate thickness, preparing an RFID chip emitting an appropriate frequency, and pressing the wooden surfaces and the RFID chip together through the use of adhesive(s) and a hot press and a cold press. The apparatus included an RFID access card constructed out of at least two wooden surfaces where an RFID chip is disposed between the two surfaces. The two wooden surfaces are attached with a hot melt adhesive.

Provided are a biodegradable eco-friendly material and a manufacturing method thereof. The biodegradable eco-friendly material includes a biodegradable base fabric into which paper mulberry yarn and cotton yarn are mixed and woven, a leather layer made of a biodegradable material attached to one side of the base fabric, and a coating layer attached to the other side of the base fabric. Here, the base fabric may be woven in a state where 74 to 76 parts by weight of the cotton yarn and 24 to 26 parts by weight of the paper mulberry yarn are mixed.

A recyclable article includes 50-90 wt % of at least one polyethylene having a density in the range 0.94 to 0.97 g/cm.sup.3. The article exhibits Young's modulus less than 700 MPa; and a haze value less than or equal to 50%. The recyclable article can be included in a film or a laminate. The article can be prepared using a blown film extrusion process.

Provided are a biodegradable eco-friendly material and a manufacturing method thereof. The biodegradable eco-friendly material includes a biodegradable base fabric into which paper mulberry yarn and cotton yarn are mixed and woven, a leather layer made of a biodegradable material attached to one side of the base fabric, and a coating layer attached to the other side of the base fabric. Here, the base fabric may be woven in a state where 74 to 76 parts by weight of the cotton yarn and 24 to 26 parts by weight of the paper mulberry yarn are mixed.

A method, apparatus, and product-by-process, for preparing an RFID access card constructed out of wood is disclosed. The method involved preparing two wooden surfaces of appropriate thickness, preparing an RFID chip emitting an appropriate frequency, and pressing the wooden surfaces and the RFID chip together through the use of adhesive(s) and a hot press and a cold press. The apparatus included an RFID access card constructed out of at least two wooden surfaces where an RFID chip is disposed between the two surfaces. The two wooden surfaces are attached with a hot melt adhesive.

A packaging cushion includes a first liner and a second liner opposite one another and each defining an inner surface. A transverse liner axis extends normal to the inner surfaces. The packaging cushion includes a mesh bonded to and disposed between the first and second liners. The mesh has a top mesh surface and an opposed bottom mesh surface. The mesh defines a plurality of nodes and a plurality of legs interconnecting the plurality of nodes. Each of the plurality of nodes defines 1) a top node surface defined by the top mesh surface, 2) a bottom node surface defined by the bottom mesh surface, and 3) a transverse node axis extending substantially normal to the top and bottom node surfaces. The transverse node axes of at least some of the plurality of nodes are each oriented at an oblique angle relative to the transverse liner axis.

A dimensionally stable universal floor covering includes a tufted textile having stitches and a reinforcement layer of fibers and adhesive providing dimensional stability for the entire floor covering. The fibers and adhesive are mixed and then moved by an applicator towards the stitches. A slip path is formed to improve the movement of the fibers and adhesive. A releasable adhesive or gecko-like cover system is provided which also provides additional strength and stability and a releasable attachment of the universal floor covering to a supporting surface.

A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further including a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layers parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer includes an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate.