The disclosed multilayer test pack comprises a channel lamina to form a recessed channel, and then a seal layer covers the recessed channel to form an embedded channel By providing the recessed channel in a thin-film channel lamina, the recessed channel tolerances are better controlled. Further, using thin films for the channel lamina, which can be formed into a roll, allows for a continuous unrolling and continuous bonding to a seal layer.

A sealing membrane including: a) a thermoplastic polyolefin membrane and b) a barrier film including b1) a barrier layer including at least one polymer selected from ethylene-vinyl alcohol copolymer, polyamide or polyester and b2) an outer layer, wherein the barrier film is laminated over the full surface area or over part of the surface area onto the polyolefin membrane, and so the outer layer is connected directly to the polyolefin membrane, and the outer layer and the polyolefin membrane are both ethylene-based or the outer layer and the polyolefin membrane are both propylene-based. The sealing membrane can be produced at low cost and has a stable interconnecting bond. It is suitable in particular for sealing in building construction or civil engineering work.

A sealing membrane including: a) a thermoplastic polyolefin membrane and b) a barrier film including b1) a barrier layer including at least one polymer selected from ethylene-vinyl alcohol copolymer, polyamide or polyester and b2) an outer layer, wherein the barrier film is laminated over the full surface area or over part of the surface area onto the polyolefin membrane, and so the outer layer is connected directly to the polyolefin membrane, and the outer layer and the polyolefin membrane are both ethylene-based or the outer layer and the polyolefin membrane are both propylene-based. The sealing membrane can be produced at low cost and has a stable interconnecting bond. It is suitable in particular for sealing in building construction or civil engineering work.

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Described herein is flooring formed of an eco-friendly material, where the flooring has excellent heat resistance, durability, abrasion resistance and dimensional stability, and is formed of a non-PVC material and thus is recyclable via an extrusion processing at the time of disposal after use. Specifically, eco-friendly flooring is described in which a coating layer, an overlayer having ionomers, a printing layer, at least one middle layer, and at least one underlayer are laminated in order, where the overlayer of the flooring has ionomers, at least one of the middle layer and the underlayer has a thermoplastic polyolefin-based resin, a styrene-based resin, oil, and a filler, the thermoplastic polyolefin-based resin is contained in an amount of 50 to 150 parts by weight with respect to 100 parts by weight of the styrene-based resin, and the styrene-based resin may contain 25 to 45% styrene.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

The invention relates to a multilayer biaxially oriented polyester film comprising a base layer B, an amorphous outer layer A and a further outer layer C, where this polyester film is suitable for lamination with metal sheets. The invention in particular relates to a polyester film which comprises (based on the mass of polyester) from 2 to 15% by weight of isophthalate-derived units in the base layer and which comprises more than 19% by weight of isophthalate-derived units in the amorphous layer A, and which has a silane-based coating on the outer layer A. The invention further relates to a process for the production of these films.

A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.

The present invention provides a method for producing synthetic leather using a silicone rubber coating liquid; and synthetic leather produced by the method.