A belt carcass (1) comprising one, two, or more than two impregnated layers (21,22,23,24,25); characterised in that i) each impregnated layer (21,22,23,24,25) comprises, or consists essentially of, a non-wovenfabric (3,301,302,303,304,305,306,307,308) and an impregnation material (4,401,402,403,404,405,406,407,408) comprising, or consisting essentially of, a first thermoplastic, first thermoplastic elastomer, first elastomer or first thermoset and optional additives; whereby, if there are two or more such impregnated layers (21,22,23,24,25), they are adjacent to each other, ii) if the belt carcass (1) comprises one or more such impregnated layers (21,22,23,24,25), then reinforcing filaments extending at least in part in one given direction and being in the form of one filament layer (51) are embedded in the non-woven fabric (3) of exactly one of said impregnated layers (21); or if the belt carcass (1) comprises two or more such impregnated layers (21,22,23,24,25), then reinforcing filaments extending at least in part in one given direction and being in the form of one filament layer (52,53) are sandwiched between two adjacent such impregnated layers (21/22, 24/25), and iii) the belt carcass is devoid of woven fabrics. This belt carcass can be cut into longitudinal belts or into circular disks or corner belts.

The disclosure relates to systems and methods for pressing a door assembly involving a scanning system operable to survey an outer surface of a door skin and identify a location of one or more recessed panel portions on the door skin, and a press operable to selectably actuate a group of actuators based on the identified location of the recessed panel portions, where the actuators drive press members onto the one or more recessed panel portions of the door skin during a pressing operation to facilitate crushing of portions of a core of the door assembly that underlie the recessed panel portion of the door skin.

The present disclosure describes covers for electronic devices, electronic devices, and methods of making covers for the electronic devices. In an example, a cover for an electronic device can comprise: a rigid substrate; a high refraction polymeric film adherable on the rigid substrate; a semitransparent polymeric film adherable on the high refraction polymeric film, wherein the high refraction polymeric film comprises: polyacrylic, polycarbonate, cyclic olefin copolymer, or combinations thereof, and high refractive nanoparticles, and wherein the semi-transparent polymeric film comprises: polyester, polyacrylic, polycarbonate, polyvinyl chloride, silicone rubber, or combinations thereof, and at least one colorant.

The present disclosure describes covers for electronic devices, electronic devices, and methods of making covers for the electronic devices. In an example, a cover for an electronic device can comprise: a rigid substrate; a high refraction polymeric film adherable on the rigid substrate; a semitransparent polymeric film adherable on the high refraction polymeric film, wherein the high refraction polymeric film comprises: polyacrylic, polycarbonate, cyclic olefin copolymer, or combinations thereof, and high refractive nanoparticles, and wherein the semi-transparent polymeric film comprises: polyester, polyacrylic, polycarbonate, polyvinyl chloride, silicone rubber, or combinations thereof, and at least one colorant.

A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material. A method of manufacturing a composite structural component is disclosed. The method can include creating a casing of a polymeric material and creating a lattice structure of a polymeric material disposed about at least a portion of the casing. The method can include sealing the porosity of the casing and lattice structure. The method can include adhering a skin of a metallic material to at least a portion of the casing. At least one of creating a lattice structure and creating a casing comprises utilizing an additive manufacturing process.

A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material. A method of manufacturing a composite structural component is disclosed. The method can include creating a casing of a polymeric material and creating a lattice structure of a polymeric material disposed about at least a portion of the casing. The method can include sealing the porosity of the casing and lattice structure. The method can include adhering a skin of a metallic material to at least a portion of the casing. At least one of creating a lattice structure and creating a casing comprises utilizing an additive manufacturing process.

A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

A multilayer integral geogrid, including one or more cellular layers, has a plurality of oriented multilayer strands interconnected by partially oriented multilayer junctions with an array of openings therein. The multilayer integral geogrid having one or more cellular layers is produced from a coextruded or laminated multilayer polymer starting sheet. The integral geogrid has a multilayer construction, with at least one outer layer thereof having the cellular structure. By virtue of the cellular layer structure, the multilayer integral geogrid provides for increased layer vertical compressibility under load, resulting in enhanced material properties that provide performance benefits to use of the multilayer integral geogrid to stabilize and strengthen soil, aggregates, or other particulate materials.

A multilayer integral geogrid, including one or more cellular layers, has a plurality of oriented multilayer strands interconnected by partially oriented multilayer junctions with an array of openings therein. The multilayer integral geogrid having one or more cellular layers is produced from a coextruded or laminated multilayer polymer starting sheet. The integral geogrid has a multilayer construction, with at least one outer layer thereof having the cellular structure. By virtue of the cellular layer structure, the multilayer integral geogrid provides for increased layer vertical compressibility under load, resulting in enhanced material properties that provide performance benefits to use of the multilayer integral geogrid to stabilize and strengthen soil, aggregates, or other particulate materials.