The present invention provides aramid compound paper with a pinning effect and a preparation method for the aramid compound paper. The preparation method for the aramid compound paper includes the following steps: preparing aramid paper from polyphenylene sulfide meltblown superfine fibers and aramid chopped fibers with wet papermaking; then placing polyphenylene sulfide meltblown superfine fiber non-woven fabrics on two sides of aramid base paper as face layers respectively; embedding the polyphenylene sulfide superfine fibers on the face layers into pores of the aramid paper at a middle layer by using a hot-pressing technology to be fusion-joined to the polyphenylene sulfide super-short fibers which are uniformly dispersed in the aramid base paper, so as to form the pinning effect; and meanwhile, melting and then solidifying the polyphenylene sulfide superfine fibers between the aramid chopped fibers to form a continuous network, and firmly bonding the aramid chopped fibers.

The present invention provides aramid compound paper with a pinning effect and a preparation method for the aramid compound paper. The preparation method for the aramid compound paper includes the following steps: preparing aramid paper from polyphenylene sulfide meltblown superfine fibers and aramid chopped fibers with wet papermaking; then placing polyphenylene sulfide meltblown superfine fiber non-woven fabrics on two sides of aramid base paper as face layers respectively; embedding the polyphenylene sulfide superfine fibers on the face layers into pores of the aramid paper at a middle layer by using a hot-pressing technology to be fusion-joined to the polyphenylene sulfide super-short fibers which are uniformly dispersed in the aramid base paper, so as to form the pinning effect; and meanwhile, melting and then solidifying the polyphenylene sulfide superfine fibers between the aramid chopped fibers to form a continuous network, and firmly bonding the aramid chopped fibers.

Various examples are provided related to panel systems fabricated from bamboo. In one example, a panel system includes a central core including a layer of substantially aligned bamboo poles; a first outer lath layer including substantially aligned bamboo lathes or poles extending across a first side of the central core; and a second outer lath layer including substantially aligned bamboo lathes or poles extending across a second side of the central core. The bamboo lathes or poles of the first outer lath layer can be at an angle with respect to the bamboo poles and the bamboo laths or poles of the second outer lath layer can positioned at the same or another angle with respect to the bamboo poles. In other examples, beams or other structural elements can be fabricated using one-way lamination of bamboo elements.

Various examples are provided related to panel systems fabricated from bamboo. In one example, a panel system includes a central core including a layer of substantially aligned bamboo poles; a first outer lath layer including substantially aligned bamboo lathes or poles extending across a first side of the central core; and a second outer lath layer including substantially aligned bamboo lathes or poles extending across a second side of the central core. The bamboo lathes or poles of the first outer lath layer can be at an angle with respect to the bamboo poles and the bamboo laths or poles of the second outer lath layer can positioned at the same or another angle with respect to the bamboo poles. In other examples, beams or other structural elements can be fabricated using one-way lamination of bamboo elements.

Nonwoven fabrics having liquid barrier properties are provided. The nonwoven fabrics may include one or more nonwoven layers, in which one or more of the nonwoven layers may include a liquid-barrier-enhancing-additive (LBEA) comprising an amide. The nonwoven fabrics may be suitable for use in a wide variety of liquid barrier applications, including facemasks, surgical gowns, surgical drapes, lab coats, and barrier components of absorbent articles (e.g., barrier leg cuffs).

Nonwoven fabrics having liquid barrier properties are provided. The nonwoven fabrics may include one or more nonwoven layers, in which one or more of the nonwoven layers may include a liquid-barrier-enhancing-additive (LBEA) comprising an amide. The nonwoven fabrics may be suitable for use in a wide variety of liquid barrier applications, including facemasks, surgical gowns, surgical drapes, lab coats, and barrier components of absorbent articles (e.g., barrier leg cuffs).

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.