A cladding panel comprising a top multi-film layer and a base layer configured for connection to a substrate, the top multi-film layer including at least an external substantially transparent film and a granular film adjacent to the external substantially transparent film. Disclosed are also methods of producing the cladding panel and kits of cladding panels.

A cladding panel comprising a top multi-film layer and a base layer configured for connection to a substrate, the top multi-film layer including at least an external substantially transparent film and a granular film adjacent to the external substantially transparent film. Disclosed are also methods of producing the cladding panel and kits of cladding panels.

A method of making a light weight component is provided. The method including the steps of: forming a metallic foam core into a desired configuration; applying an external metallic shell to an exterior surface of the metallic foam core after it has been formed into the desired configuration; and attenuating the component to a desired frequency by forming a plurality of openings in the external metallic shell.

An underlayment material has a fiber mat partially infused and/or coated with asphalt and coated with silicone coating. A selvedge edge, may be coated or uncoated. The back of the underlayment has a self-adhesive coating, which is protected before use by a siliconized release film. The upper surface of the underlayment is coated with silicone composition providing waterproofing and radiation control. When unsaturated, the selvedge edge of fibrous material establishes a reinforced bond with an overlying sheet. When saturated with asphalt, the bond at the selvedge edge between adjacent sheets is between the asphalt layer of the selvedge edge and the adhesive on the bottom of the adjacent sheet.

A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.

A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.

The present invention relates to an optically anisotropic sheet comprising a substrate and a liquid crystal cured layer laminated together, wherein the substrate has a surface roughness of 1.0 nm or less in a field of view of 1 μm.sup.2 and a water contact angle of 70° or more.

The present invention relates to an optically anisotropic sheet comprising a substrate and a liquid crystal cured layer laminated together, wherein the substrate has a surface roughness of 1.0 nm or less in a field of view of 1 μm.sup.2 and a water contact angle of 70° or more.

Textile reinforcement that can be used for the production of composite parts by pultrusion, including a central layer made from glass fibre segments and polyester, and in which, in the central layer, the glass fibre segments are enrobed with polyester, the central layer including a central reinforcement core surrounded by the glass fibre segments enrobed with polyester, at least one fibre-web surface layer forming one of the external faces of the textile reinforcement.

Manufacturing a semiconductor apparatus includes preparing a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, coating a semiconductor-device mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor-device forming surface of a wafer on which semiconductor devices are formed with the thermosetting resin layer of the support-base attached encapsulant, heating and curing the thermosetting resin layer to collectively encapsulate the semiconductor-device mounting surface of the substrate or the semiconductor-device forming surface of the wafer, and cutting the encapsulated substrate or wafer by dicing. Coating includes surrounding a side face of the support-base attached encapsulant by a frame mechanism, holding the substrate or the wafer with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, and vacuum laminating the support-base attached encapsulant together with the substrate or the wafer.