Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers.

The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

The laminate comprises a porcelain sheet with a thickness of two to three millimetres, adhered to a base or support sheet made of MDF or particleboard or high density foam or polyethylene or polypropylene or ABS or foamed PVC or methacrylate or a metal sheet of aluminium or steel, using as the adhesion means a two-component polyurethane or a PUR adhesive, producing a laminate that encompasses the advantages of the nature of the two materials, the porcelain and the base, as well as saving material, and being lighter, having higher thermal and acoustic insulation levels, improved resistance to bending loads and allowing to add additional layers, such as a metal sheet of thickness from 0.1 to 1 mm in order to obtain a greater flatness, or a combination with rubber or elastomer layers to improve the acoustic insulation level.

A composite plate includes a first plate (5); a second plate (16); and a first side surface of the first plate (5) including striations. A first side surface of the second plate (16) and the first side surface of the first plate (5) are rolled to connect, and wherein adjacent striations (14) have a pitch of 0.005 mm to 0.03 mm account for more than 90% of all the striations (14).

A carbon fiber tubular pole and method of construction thereof. The pole includes a left in place lightweight mandrel, preferably formed of tubular polyvinylchloride or cardboard, which substantially reduces cost of manufacture. A socket is formed in the carbon fiber tubular pole for receiving an adjacent carbon fiber tubular pole.

A semiconductor element producing method is disclosed. In the method, a surface protective tape including a base layer and an adhesive layer (including an intermediate layer) is attached to the front surface of a wafer that has unevenness caused by a polyimide passivation. The wafer is placed on a stage, with the surface protective tape facing the stage. The surface protective tape is heated while being drawn to the stage to flatten the surface of the surface protective tape. A grinding process is performed on the rear surface of the wafer to reduce the thickness of the wafer. A rear surface element structure is formed on the rear surface of the wafer, and the wafer is diced into chips.

A preparation method of a polytetrafluoroethylene (PTFE)-based membrane for preventing and removing ices covering wind turbine blades is provided and the method comprises: preparing a membrane into a PTFE rod material with polymerized monomers by using monomer polymerization methods such as blending, pre-compressing and pushing; making the membrane into a PTFE-based homogeneous membrane with micropores and nano and micron scale concave-convex geometrical ultra-structure morphologies under the condition that the membrane is cracked to generate a laminar exfoliated fabric-like structure in the hot calendaring process of the PTFE rod material by using a hot calendaring and fusion polymerization method; and applying the PTFE-based homogeneous membrane to blades of a large wind turbine in operation.

Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

An apparatus, composition, and method for affixment of dissimilar materials, that includes a ceramic longwise member having a distal portion and a proximal portion that has a pilot, also included is a steel receptacle including primary and secondary voids that are co-axial and in communication with one another. The longwise member pilot is received in the primary void with the remainder of the proximal portion having an open gap within the secondary void, wherein adhesive is disposed within the open gap and the distal portion projects beyond the receptacle. Operationally, resulting in the longwise member and the receptacle resisting a separating force apart from one another.

Reactive composition includes a reactive component able to form an adhesive bond between two substrates, at least one of which comprises a plastic material. The substrate may include an initiator on or near the surface thereof. The initiator may be present in the plastic material inherently, by blending in an additive package, through injection molding, or other process. The reactive component may comprise a methylene malonate, a reactive multifunctional methylene, a methylene beta ketoester, a methylene beta diketone. A carrier component for the reactive component may be selected to interact with the plastic substrate to soften and/or penetrate the surface to be bonded. The surface of the plastic may be abraded or otherwise treated to expose the initiator. The reactive component, upon contact with a suitable initiator, is able to polymerize to form an interpenetrating polymer weld.

A chip-to-chip eutectic bonding system includes a stage with a top surface, a bottom surface, and a plurality of vacuum apertures extending therebetween and a carrier with a top surface, the top surface including one or more smooth surface portions and one or more rough surface portions, wherein at least one smooth carrier surface portion laterally aligns to at least one vacuum aperture, and at least one of the stage's rough surface portions frictionally couples to at least one of the carrier's rough surface portions when the carrier top surface couples to and opposes the stage bottom surface.