The present invention concerns a process for preparing a microfibrous multilayer composite material comprising: 1) realizing a non-woven microfibrous semi-finished product made up of microfibres of one or more polymers dispersed in a polyurethane matrix (semi-finished product IE); 2) cutting the semi-finished product lengthwise into two layers; 3) buffing at least one layer on one side (side N) so as to extract the microfibres and form the nap, thereby obtaining a semi-finished raw product; 4) cutting at least one semi-finished raw product lengthwise parallel to the surfaces, producing an non-woven intermediate product, containing the buffed side (side N) and a waste layer (containing the side that has not been buffedside S); 5) coupling the non-woven intermediate product (on the side opposite side N) to a fabric made of polyethylene terephthalate fibres by means of the application of a thermoplastic polyurethane adhesive that can be cross-linked between the non-woven intermediate product and the fabric; 6) submitting the multilayer composite material to a jet dyeing process. The invention also concerns a multilayer composite material that can be obtained by the process of the invention and the use thereof for covering the internal side of roofs or headliners of vehicles and for covering furnishing elements.

Techniques for modifying surfaces of electrodes are provided. An electrode surface can be processed by applying an abrasive material or chemical solution to or against the surface to modify the surface to reduce the amount of roughness on, and/or alter the shape of, the surface. The shape of the surface can be altered by rounding or doming the surface. During surface processing, flexible or compressible support material can be applied to the back of an abrasive material, such as sandpaper, to desirably distribute pressure from the support material to the sandpaper and/or mold the shape of the sandpaper to facilitate maintaining desirable contact by the sandpaper on electrode surfaces. With regard to a flexible circuit board on which electrodes are formed, a vacuum chuck component or a temporary abrasive can be used to hold the circuit board in a flat and stationary position during surface processing.

In one aspect, a method of preparing a composite wood panel is provided herein which includes: providing a flat core formed of cellulosic material having opposing top and bottom faces, wherein a density profile is defined across the core representing density of the core at different locations between the top and bottom faces, the density profile including a first density profile portion extending from the bottom face towards the top face and including a first maximum density, a second density profile portion extending from the top face towards the bottom face and including a second maximum density, and a third density profile portion extending between, and connecting, the first and second density profile portions; removing the top face, and an adjacent layer, of the core to remove the second maximum density and to define an exposed face; and, adhering, using an adhesive, a veneer to the exposed face.

A surfacing product (e.g., flooring element) can be elongate along a longitudinal axis. The surfacing product can have a core having a first surface and an opposed second surface that are spaced along a thickness axis. A veneer can be coupled to the first surface of the core. The veneer can have a first veneer segment that is elongate along the longitudinal axis, a second veneer segment that is elongate along the longitudinal axis, and an insert segment positioned between the first veneer segment and the second veneer segment along the longitudinal axis.

The thermoacoustic energy converting element part includes a plurality of through holes extending along a uniform direction to penetrate a body of the thermoacoustic energy converting element part to form traveling paths of acoustic waves. The element part includes a wall surrounding each of the through holes to extend in an extending direction of the through hole and configured to exchange heat between the fluid. The through hole includes a through hole that has a hydraulic diameter of 0.4 mm or smaller, and an open area ratio of the through holes is 60% or higher. A first layer and a second layer are alternately provided on the wall of the thermoacoustic energy converting element part along the extending direction. A porosity of the first layer is 0% or smaller than a porosity of the second layer. The thermal conductivity of the structure of the thermoacoustic energy converting element part along the extending direction is 2 W/m/K or lower. If a metal plate is provided as the first layer, a plurality of the metal plates having a roughened main surface is layered and bonded by thermocompression bonding to manufacture the thermoacoustic energy converting element part.

The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.

A roll-to-roll method for manufacturing 2D/3D grating switch membrane is performed in such a way that: Step 1 and Step 2 are simultaneously performed, then Step 3 is performed, and finally Step 4 is performed: Step 1, subjecting a concave grating facing down to rubbing and liquid crystal dropping; Step 2, uniformly coating a PI liquid onto a surface layer of a mirror-face metal roller, and performing self-hating and rubbing; Step 3, making the concave grating rubbed and dropped with liquid crystals in Step 1 and PI layer coated and directionally-rubbed on the mirror-face metal roller in Step 2 attached to each other, forming a grating membrane, and rotating and pre-baking the grating membrane with the mirror-face metal roller; Step 4, curing the attached and baked grating membrane by the UV curing means and after stripping, collecting and winding through the 2D/3D grating switch membrane collecting roller.

This invention provides methods for the processing of platinum metallized high temperature co-fired ceramic (HTCC) components with minimum deleterious reactions between platinum and the glass constituents of the ceramic-glass body. The process comprises co-firing a multilayer laminate green ceramic-glass body with via structures filled with a platinum powder-based material in a reducing atmosphere with a specified level of oxygen partial pressure. The oxygen partial pressure should be maintained above a minimum threshold value for a given temperature level.

Disclosed herein is a method of manufacturing a natural cork film, which includes forming a thin cork layer by slicing a prepared natural cork material, forming a fiber layer by attaching a fiber sheet to one surface of the cork layer formed in the forming a thin cork layer, pre-treating a lamination of the cork layer and the fiber layer formed in the forming a fiber layer, for preventing discoloration of the cork layer, and forming a resin layer by attaching a resin sheet to the fiber layer passing through the pre-treating a lamination of the cork layer and the fiber layer. Accordingly, it is possible to prevent the manufactured cork film from naturally discoloring due to light and to significantly reduce a phenomenon such as brittleness or wrinkling caused when the cork layer is decolorized alone.

A processing method of a bonded wafer includes generating coordinates of an outermost circumference of a joining layer, forming a plurality of modified layers by positioning focal points of laser beams inside a first wafer, from a back surface of the first wafer, holding a second wafer side on a chuck table and grinding the back surface of the first wafer to thin the first wafer. The plurality of focal points of the laser beams are set in a form of descending stairs to reach the lowermost focal point from the uppermost focal point so as to gradually get closer to the joining layer from an inner side toward an outer side in a radial direction of the first wafer. A crack that extends from the modified layer formed by the lowermost focal point reaches the coordinates of the outermost circumference of the joining layer.