A wafer has a layer containing silicon, a layer of polycrystalline diamond deposited on the silicon-containing layer, and a bow-compensation layer on the other side of the silicon-containing layer for reducing wafer-bow. A method of making a bonded structure includes an activation process for creating dangling bonds on the surface of one substrate, followed by contact-bonding the surface to a second substrate at low temperature. A bonded structure may include two substrates contact bonded to each other, one substrate including a layer containing silicon, a layer of polycrystalline diamond, a bow-compensation layer for reducing wafer-bow of the first substrate, and the other substrate including gallium nitride, silicon carbide, lithium niobate, lithium tantalate, gallium arsenide, indium phosphide, or another suitable material other than diamond.

An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.

Disclosed herein are customizable overlay systems that can be used indoors or outdoors. In an aspect, a disclosed overlay system can be used to provide a variety of athletic playing surfaces. Disclosed herein are methods of installing a disclosed customizable overlay system.

Thermoplastic films are disclosed that are suitable for use as auto wraps. The films include a thermoplastic polyurethane layer comprising a thermoplastic polyurethane polymer and a patterned adhesive layer. The thermoplastic films, when tested by a 25% Heat Relaxation Test at a thickness of about 0.006 inches, exhibit a final load from about 0.02 to about 0.3 pounds force; and when tested by a 25% Elastic Recovery test, exhibit a residual strain at one minute of 2% or greater.

Thermoplastic polyurethane compositions are disclosed, comprising: a thermoplastic polyurethane polymer or polymer blend comprising the reaction product of: an aliphatic diisocyanate, an aliphatic polyol, and a chain extending agent, wherein the thermoplastic polyurethane composition: when tested by a 25% Heat Relaxation Test at a thickness of about 0.006 inches, exhibits a final load from about 0.02 to about 0.3 pounds force; and when tested by a 25% Elastic Recovery test, exhibits a residual strain at one minute of 2% or greater.

A lamination device and a lamination method for attaching a film layer onto a substrate are provided. The lamination device includes a platform configured to carry and deliver a substrate, a layer application member configured to apply the film layer onto a surface of the substrate, a first roller configured to roll on the substrate having the film layer to perform a smoothing and bubble-removing operation, a deformable layer arranged on the first roller and capable of being deformed to change a rolling dot pattern at an outer circumferential surface of the first roller, thereby to enable the rolling dot pattern to match the surface of the substrate, and an alignment mechanism configured to align the substrate with the first roller.

A resin composite having excellent strength is easily produced by using a resin foam having a specific surface roughness (Ra) as the core material of the resin composite.

Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

The present invention belongs to the field of shielding mechanics for personal protective equipment and more specifically relates to the external shielding of a transparent glass or armor curved and laminated on its periphery, which has an argon chamber for automobile windows that does not requires modification of door or window frames; since it proposes a new solution with a reinforced flange that is established in the armor and not in the frame of the vehicle, made up of a perimeter steel flange, glass of different sizes, reinforcing polycarbonates and an argon chamber that makes it light, thin, which does not fog up due to temperature changes and blocks external bullet impacts but is permissive to the passage of bullets towards the outside of the vehicle due to internal impact.

An anisotropic thermal interface device including plural aligned thermally anisotropic conductive composite layers. Each layer has a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction. The aligned thermally anisotropic conductive composite layers extend substantially parallel to each other in the first direction and include 45-95 weight percent graphite flakes aligned in the second direction. The thermally anisotropic conductive composite layers have a binder including a branched siloxane. The thermally anisotropic conductive composite layers are adhered to adjacent thermally anisotropic conductive composite. The thermally anisotropic conductive composite layers have a second thermal conductivity of 25 to 45 W/mK. The anisotropic thermal interface device has an arithmetic average surface roughness of 5 to 20 m and a tensile strength of 50 to 130 KPa.