The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The crosslinked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.

Method and composition for switchable panels are disclosed. Switchable films are placed between glass and liquid resin is injected between the glass and cured. The panels may be used for a wide variety of applications.

A method for forming of a building panel with a surface including a thermosetting resin such that tension created during curing of the surface is reduced or eliminated.

Methods for reworking structures and reworked cellular core panels, reworked structures comprising the reworked cellular core panels, and guides and cutting apparatuses for reworking cellular acoustic panels and reworking cellular acoustic and non-acoustic panels are disclosed.

A method for producing a member for a semiconductor manufacturing apparatus includes (a) a step of providing an electrostatic chuck, a supporting substrate, and a metal bonding material, the electrostatic chuck being made of a ceramic and having a form of a flat plate, the supporting substrate including a composite material having a difference in linear thermal expansion coefficient at 40 to 570° C. from the ceramic of 0.2×10.sup.−6/K or less in absolute value, and (b) a step of interposing the metal bonding material between a concave face of the supporting substrate and a face of the electrostatic chuck opposite to a wafer mounting face, and thermocompression bonding the supporting substrate and the electrostatic chuck at a predetermined temperature to deform the electrostatic chuck to the shape of the concave face.

A method for producing a composite component including a bottom layer, cover layer and honeycomb structure, including applying the honeycomb structure to the bottom layer wherein honeycomb chambers are formed. Honeycomb chambers are filled in a reinforcement region with a granular material and granular material is removed from other honeycomb chambers wherein each honeycomb chamber is filled up to a granular-material filling height and honeycomb chambers outside the reinforcement region are free of granular material. The cover layer is applied to the honeycomb structure wherein the honeycomb chambers are closed. The composite component is heated so the granular material in the honeycomb chambers expands to fill it with granular material and the cover layer, the bottom layer, the honeycomb structure and the expanded granular material harden, the density of the expanded granular material in the honeycomb chambers filled with granular material being dependent on the granular-material filling height.

An insertion device includes an elongate member and a stylet. The elongate member has a proximal end portion, a distal end portion, and defines a lumen therethrough. The stylet has a proximal end portion, a distal end portion, and is slidably coupled to the elongate member. The stylet is configured to move from a first position to a second position with respect to the elongate member. The proximal end portion of the stylet is configured to removably couple a mesh carrier thereto. A portion of the proximal end portion of the stylet is disposed outside of the lumen of the elongate member when the stylet is in its first position and is disposed within the lumen when the stylet is in its second position.

The present invention discloses a surface covering, in particular a floor or wall covering comprising: - a substrate A, having an upper and a lower surface, said substrate (A) being characterized by a deformation of less than 40 degrees, preferably of less than 30 degrees, more preferably of less than 20 degrees, most preferably of less than 10°, as measured for a rectangular substrate A sample with dimensions of 160 mm×450 mm, partially contacting and fixed in a horizontal position to a plate support, so that exactly a 160×300 mm part of said sample exceeds the edge of the plate support and is free of support during the deformation measurement, .circle-solid. the deformation being recorded 30 seconds after removing means that prevent a deformation of the 160×300 mm part under the influence of its own weight, .circle-solid. the deformation, being the angle, in degrees, between the horizontal position and the position after 30 seconds, of the extreme bottom edge of the freely suspended 160×300 mm part of said rectangular substrate sample (A), free of support and deforming under its own weight away from the horizontal position; - a scuff resistant polymer layer B, having an upper and a lower surface, said polymer layer B comprising one or more polymer(s) C, said one or more polymer(s) C comprising more than 93.5% by weight of cellulose ester polymer(s); the lower surface of polymer layer B contacting and adhering to the upper surface of substrate A.

The disclosure provides a method for forming an information carrying card or a core layer of an information carrying card using a radiation curing, and an apparatus configured to provide such a radiation curing. The method includes providing a carrier layer that defines at least one cavity, providing an inlay layer supporting at least one electronic component, and positioning at least a portion of the inlay layer in the at least one cavity. The method further comprises dispensing a radiation crosslinkable polymer composition over the inlay layer, and irradiating the radiation crosslinkable polymer composition.

A method for manufacturing a sound-absorbing panel with a sandwich structure for reducing noise impact of an aeronautic engine includes providing a first skin of a thermoplastic polymeric material, making a plurality of micro-holes through the first skin by mechanical punching of the first skin, securing the first skin to a central layer by arranging a structural adhesive layer between the first skin and the central layer and/or by a thermal weld between the first skin and the central layer, and securing the central layer to a second skin by arranging a structural adhesive layer between the central layer and the second skin and/or by a thermal weld between the central layer and the second skin.