A method of assembling a display panel includes laminating a back plate to a display layer to form an untrimmed display panel, the back plate including a metal layer that includes a trimming path defined by one or more line segments having reduced metal content compared to other portions of the metal layer. The method further includes trimming the untrimmed display panel along the one or more line segments to define one or more edges of the display panel. For one or more locations along each of the one or more edges defined by the line segments, the metal layer is flush with the corresponding edge of the display panel.

A method of removing a backing layer from a panel, made of an uncured pre-impregnated fiber-reinforced polymer, comprises a step of orienting the panel into a backing-separation orientation relative to an edge-engagement tool. The method also comprises a step of positioning the panel into a backing-separation position relative to the edge-engagement tool. The method further comprises a step of moving the edge-engagement tool, when the panel is in the backing-separation orientation and the backing-separation position, so that backing-engagement features of the edge-engagement tool engage the backing layer, at only an edge portion of the backing layer, and just the edge portion of the backing layer separates from the panel. The method additionally comprises a step of gripping the edge portion of the backing layer, and, when gripped, moving the backing layer relative to the panel so that an entirety of the backing layer separates from the panel.

The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.

According to an embodiment of the present disclosure, a method of labeling a plurality of products includes coating a pressure sensitive adhesive to a roll of face stock, the roll of face stock configured to be converted to a plurality of individual labels aligned in a single lane; singulating an individual label from the roll of face stock; and applying the individual label to a product of the plurality of products, wherein the coating, singulating and applying are conducted sequentially in a single continuous operation with a single continuous web of material.

Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.

A light-weight structural panel is formed by pultruding a closed-cell foam core embedded with high-strength reinforcing pins through a pair of heated platens along with upper and lower sheets of woven fiber glass wetted by a polymer resin. The lengths of the reinforcing pins exceeds the thickness of the core so the platens compress the skin sheets forming pockets which accumulate excess resin that, when it cures, forms a more stable panel.

The present application relates to an encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same and a method for manufacturing an organic electronic device using the same. The present invention provides an encapsulation film which can form a structure capable of effectively blocking moisture or oxygen flowing from the outside into an organic electronic device, has excellent handling property and workability, and has excellent adhesion property and endurance reliability between the encapsulation film and the organic electronic device.

Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.

A method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

An object with a conductive element on a receiving carrier layer and a roll-to-roll processing method for manufacturing it. The solution is based on the idea of operating systematically with two different types of adhesives in selected stages of the roll-to-roll processing. A very thin layer of conductive material can be accurately and reliably transferred to adhesively attach on a desired carrier surface.