Patent classifications
B32B38/145
SUBSTRATE BONDING METHOD AND DISPLAY SUBSTRATE MANUFACTURED THEREBY
The present invention relates to a substrate bonding method and a display substrate manufactured thereby, the method comprising the steps of: (1) forming a pattern by ink-jet printing a photo-curable adhesive ink on a lower substrate; (2) forming a spacer on the lower substrate by photo-curing the pattern; (3) forming an adhesive layer by ink-jet printing the photo-curable adhesive ink on the surface of the lower substrate on which the spacer is formed; and (4) laminating the adhesive layer of the lower substrate and an upper substrate by performing photo-curing.
Method and system for preparing substrates before gold-plated
The invention concerns a method and/or a system for personalizing substrates and/or preparing substrates before gold-plating. In particular, the invention consists of a printing method comprising a step in which the substrate is subjected to inkjet printing followed by a gold-plating step in which the regions of the substrate to be gold-plated are brought into contact with the gold-plating leaf, characterized by an additional step performed prior to the gold-plating step and which consists in the preparation of the substrate.
Heat sealable thermo-printable tape
A heat-sealable thermoprintable tape includes an extruded thermoplastic coating having a smooth printable surface on a first side, and an extruded heat-seal polymer layer disposed on a second side of the extruded thermoplastic coating, opposite the first side. The extruded thermoplastic coating is bonded to the heat-seal polymer layer to form the heat-sealable thermoprintable tape. A method of forming a heat-sealable thermoprintable tape includes providing a support layer having an open structure configured to support an extruded coating, applying a polyurethane coating onto a first side of the support layer and into open spaces of the open structure to form a top surface, and extruding a heat-sealable polymer onto a second side of the support layer opposite the first side and into the open spaces of the open structure. The polyurethane coating bonds to the heat-sealable polymer within the open structure of the support layer.
RESILIENT FLOORING PRODUCT AND METHODS OF MAKING SAME
Described herein are resilient floor coverings produced by using digitally printed UV-cured inks and exhibiting high adhesion properties between an ink layer and a wear layer. Also described herein are methods for manufacturing same. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
PROCESS FOR CREATING A SUBLIMATED PRINTED HEAT-SEALABLE APPLIQUE
A process for producing a colorfast thermal appliqué using a polyester knit fabric blank, dye-sublimation printing a graphic image on the fabric blank, and laminating a triple-layer polyurethane adhesive on another side of the printed fabric blank. The triple-layer adhesive comprises a first layer of clear ink resistant polyurethane adhesive followed by a white-pigmented ink resistant polyurethane adhesive and a third clear layer of ink-resistant polyurethane adhesive. The first layer of the triple-layer adhesive is fused under combined temperature and pressure to the polyester blank until said first and second layers impregnates into said fabric blank. The fabric blank is then cut into a discrete finished appliqué that does not substantially change the physical and visual characteristics of a performance fabric substrate to which the appliqué is applied.
FLOOR PANEL
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
CERAMIC-CONTAINING AND CERAMIC COMPOSITE TRANSACTION CARDS
A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.
Method of producing a multi-layered printed absorbent article
A method for producing a multi-layered absorbent article is disclosed. At least two of the layers include a colored region.
LIDDING FILM FOR ASEPTIC PACKAGING
A method for providing a film lidding structure which can survive aseptic processing, the method comprising: providing a high-density polyethylene (HDPE) or polypropylene (PP) film layer; laminating the HDPE or PP film layer to at least one base layer to form a lidding; adhering the at least one base layer to the rim of a container to form a lidded container; and sterilizing the lidded container using high concentration hydrogen peroxide at elevated temperature.
NFC card manufacturing
A multiple ply printed product and a method of producing it are described. The method comprises providing a substrate layer having a first surface supporting at least one wireless communication chip and a second surface, reverse to the first surface. A first paper stock having a first surface and a second surface is also provided. A first bonding operation is performed to substantially bond together the first surface of the substrate layer and the second surface of the first paper stock, to sandwich the wireless communication chip between the first paper stock and the substrate layer; providing a second paper stock having a first surface and a second surface. At least one of the first surface of the first paper stock and the second surface of the second paper stock may be printed on. A second bonding operation is performed to bond together the first surface of the second paper stock and the second surface of the substrate layer, to form a multiple ply printed product where the first surface of the substrate layer supports a plurality of wireless communication chips and the multiple ply printed product is a sheet on which is printed a plurality of business cards, each business card corresponding to a respective wireless communication chip.